Interface Microstructure and Mechanical Properties of Copper/Aluminum Composite Material

Bao Yi Yu; Qing Wang; Qiang Li; Yu Juan Wu; Yan Chen

doi:10.4028/www.scientific.net/AMR.753-755.207

Paper Titles

Evaluation of Variation Mechanical Properties in AZ91D Magnesium Alloy Processed by Extrusion and ECAP
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Effect of Nonuniform Water Convection on Laminar-Flow Cooling
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Surface Roughness in Incremental Sheet Metal Forming of AA5052
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Interface Microstructure and Mechanical Properties of Copper/Aluminum Composite Material
p.207

A Study on Gear Tooth Metal Flowing Law and Process Optimization of Spiral Bevel Gear Forging
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A Distribution Medium Considered Resin Flow Simulation Model for Vacuum Infusion Molding Process
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Development of HOFC Work Roll Curve for Strip Rolling Mill
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Analyzing and Control of Surface Inclusion Defect of Hot-Rolled Coil
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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 753-755Interface Microstructure and Mechanical Properties...

Interface Microstructure and Mechanical Properties of Copper/Aluminum Composite Material

Abstract:

The composite was produced by pouring melt Al into solid Cu pipe. Microstructure, mechanical properties and Cu-Al composition distribution in Cu/Al composite interface were studied in the paper. The experimental results show that Cu and Al diffuse to each other, which the Cu/Al interface zone is formed. Moreover, there are lots of Cu-Al phase appearing in the Cu/Al interface zone. Furthermore, the influences of annealing temperature on the peal strength of Cu/Al interface were tested, in which the peel strength of the Cu/Al interface zone reaches the highest point to 15 MPa at 350°C and then decreases with the annealing temperature increases. In addition, the width of the diffusing layer and the average grain size of the Cu/Al interface zone increase with the annealing temperature increases.

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Periodical:

Advanced Materials Research (Volumes 753-755)

Pages:

207-214

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.753-755.207

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Online since:

August 2013

Authors:

Bao Yi Yu, Qing Wang, Qiang Li, Yu Juan Wu, Yan Chen

Keywords:

Cu/Al Composite, Interface, Microstructure, Peel Strength

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