The Influence of Initial Microstructures on the Diffusion Bonding Interface of High Nb Containing TiAl Alloy

Abstract:

The solid-state diffusion bonding experiments of high Nb containing TiAl alloy were successfully carried out at 950°C under a uniaxial pressure of 30MPa for 45min, and the influence of different initial microstructures, such as initial forged microstructure (named duplex microstructure) with different grain sizes, near lamellar microstructure and full lamellar microstructure, on the interface of the bonding joints were investigated. And the microstructure characterization of interfaces was taken by OM, SEM, EDS and micro-hardness tester. The results indicated that the grain size and strain energy are of great importance to improve the quality of interfacial bonding. Besides, the interfacial microstructure was found different from matrix and changed during the diffusion bonding process. Meanwhile, micro-hardness tests of the three kinds of joints showed that the micro-hardness in the interface was slightly higher than matrix in all the joints, resulted from the working hardening of the interface under the uniaxial pressure.

• Periodical: Advanced Materials Research (Volumes 753-755)
• Pages: 396-401
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.753-755.396
• Online since: August 2013
• Authors: Ying Hao Wang, Xian Sheng Qi, Xian Lin Meng, Wen Bin Li, Chuan Yun Wang, Hong Chao Kou, Jin Shan Li
• Keywords: Diffusion Bonding, Microhardness, Microstructure, TiAl Alloys

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