Signal Integrity Analysis of High-Speed Signal Connector USB3.0

Shi Lei Zhou; Ya Lin Guan; Xin Kun Tang

doi:10.4028/www.scientific.net/AMR.760-762.320

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 760-762Signal Integrity Analysis of High-Speed Signal...

Signal Integrity Analysis of High-Speed Signal Connector USB3.0

Abstract:

High-speed signal connector has become a key factor of the signal transmission quality in telecommunications and data communications system. Signal integrity of connector is an inevitable problem. This paper based on the theory of differential transmission lines and Multimode S-Parameters, analyzed the USB3.0 connector signal integrity. And use 3D simulation software CST to build model and analyze the relationship of signal integrity and connectors geometry.

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Periodical:

Advanced Materials Research (Volumes 760-762)

Pages:

320-324

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.760-762.320

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Online since:

September 2013

Authors:

Shi Lei Zhou, Ya Lin Guan, Xin Kun Tang

Keywords:

Crosstalk, Differential Signaling, Insertion Loss, Signal Integrity, USB3.0

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References

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