Research on Performance of Flame-Retardant Epoxy Resin Electronic Packaging Materials

Hao Ran Zhou; Shuang Zhao; Wei Miao Yu; Hao Jiang; Cui Guo; Ye Li

doi:10.4028/www.scientific.net/AMR.763.117

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 763Research on Performance of Flame-Retardant Epoxy...

Research on Performance of Flame-Retardant Epoxy Resin Electronic Packaging Materials

Abstract:

In this article, a new flame-retardant epoxy electronic packaging materials was synthesized through the reaction of matrix resin (E-51), flame retardant (neopentyl glycol phosphate melamine sale, NPM), toughening agent (nitrile rubber, CTBN), curing agent (4, 4-diamino diphenyl sulfone, DDS) and curing catalyst (dosage of benzoyl peroxide, BPO). The results showed that: when the flame retardant was added in an amount of 5wt%, ultimate index (LOI) value of the EPNPM system was increased 2 than that of the EPAl (OH)₃ system. When the NPM was added in an amount of 5wt%, the tensile shear strength of the composite was increased 18.27% than that of pure composite. Consequently, the EPNPM system prepared showed betterflame retardance and the mechanical properties.

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Periodical:

Advanced Materials Research (Volume 763)

Pages:

117-120

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.763.117

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Online since:

September 2013

Authors:

Hao Ran Zhou, Shuang Zhao, Wei Miao Yu, Hao Jiang, Cui Guo, Ye Li

Keywords:

Electronic Packaging Materials, Flame Retardant Properties, Mechanical Property

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