High Power LED Packaging Materials and Tooling

Zhan Feng Zhao

doi:10.4028/www.scientific.net/AMR.763.229

Paper Titles

Mechanochemical Processing of Ultrafine Steel Slag Powders
p.211

Wear Loss Measurement of Machine Based on Mechanical Mechanics and Computer Image Analysis
p.216

Study on Wear Ratio Analysis of Materials by Computer Image Technology
p.220

Stamp Modeling, Analysis and Design of Defected Microstrip Structure for Lowpass Filters Based on Properties of Metamaterials
p.223

High Power LED Packaging Materials and Tooling
p.229

Study on Vibration of Membranes with Taylor Polynomial Method and Error Analysis for Helmholtz Equation
p.234

Research and Design of Optical-Fiber-Embedded Structure in Optical Printed Circuit Board under Thermal Shock
p.238

Hybrid Lateral Aerodynamic Modeling Based on WNN and Kernel Principal Components Feature Extraction
p.242

Optimization of Microwave Extraction Process by Response Surface Methodology of Flavonoids from Tussilago farfara L.
p.246

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 763High Power LED Packaging Materials and Tooling

High Power LED Packaging Materials and Tooling

Abstract:

The high power light emitting diodes unit internal structure was elaborated from materials and tooling point of view, the unit matrix frame layout for mass production was presented for copper sheet stamping. The tooling stations were decomposed and optimized for packaging processes. The optical lens body molding cavity layout was proposed for unit matrix transfer molding. The packaging materials and tooling was analyzed from the materials processes and automatic stamping & transfer molding. Design scheme for packaging materials processes can be referenced for high power LED unit devices.

You might also be interested in these eBooks

Advanced Materials Researches and Application

View Preview

Info:

Periodical:

Advanced Materials Research (Volume 763)

Pages:

229-233

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.763.229

Citation:

Cite this paper

Online since:

September 2013

Authors:

Zhan Feng Zhao

Keywords:

Cavity Molding, Light Emitting Diode (LED), Packaging Materials, Stamp Tooling

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] Robert F. Karlicek. High Power LED Packaging. Proc. of 2005 Conference on Lasers & Electro-Optics (CLEO), 2005, 337-339.

DOI: 10.1109/cleo.2005.201771

Google Scholar

[2] Zhanfeng Zhao, Juan Ye, Design Key Points for High Power LED Encapsulation, Advanced Materials Research Vol. 651 (2013), 706-709.

DOI: 10.4028/www.scientific.net/amr.651.706

Google Scholar

[3] Tim Whitaker. LEDs in the mainstream: technical hurdles and standardization issures. LEDs magazine, Oct., 2005, 11-13.

Google Scholar

[4] Vukota Boljanovic, Sheet Metal Forming Processes and Die Design, Industrial Press Inc, New York, (2004).

Google Scholar

[5] Lay Yeap. Meeting the Assembly Challenges in New Semiconductor Packaging Trend. 34Th International Electronic Manufacturing Technology Conference, Melaka, 2010, 1-5.

DOI: 10.1109/iemt.2010.5746731

Google Scholar

[6] Zhanfeng Zhao, Lixin Yang, Research on Progressive Die Design for Asymmetric U-shaped Contactor, Advanced Materials Research Vol. 651 (2013) , 701-705.

DOI: 10.4028/www.scientific.net/amr.651.701

Google Scholar