Research and Design of Optical-Fiber-Embedded Structure in Optical Printed Circuit Board under Thermal Shock

Abstract:

To improve the serviceability of embedded optical fiber in OPCB, the paper discussed the optical-fiber-embedded structure in OPCB from the aspects of stress. Firstly, discussed optical fiber, groove and whether to use filler and provided six kinds of embedded structures. Then, finite element models were built for thermal simulation and thermal stress in fiber was calculated. Finally, compared different embedded structures from the stress in fiber and gave some suggestion about the design of embedded structure. The study proved that glass fiber is a better selection for OPCB; the stress concentrate easily appears in the edge of glass fiber; using filler can protect uncoated glass fiber, but increase the thermal stress is in coated glass fiber; when embedding uncoated fiber, U-groove is a better choice; when embedding coated fiber, U-groove without filler is the best choice. The results are helpful to the application of glass fiber in OPCB.

• Periodical: Advanced Materials Research (Volume 763)
• Pages: 238-241
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.763.238
• Online since: September 2013
• Authors: Fu Kai Hu, De Jian Zhou, Lei Cheng
• Keywords: Glass Fiber, Optical Printed Circuit Board (OPCB), Structure Design, Thermal Simulation

References

[1] Cho H, Kang S, et al: submitted to Journal of Micromechanics and Microengineering (2004).

[2] Yuan. J, Fguang. L, et al: submitted to Optik-International Journal for Light and Electron Optics (2008).

[3] Schneider M, Ku X, et al: submitted to Journal of Lightwave Technology (2010).

[4] Feng Q, Sang X and Dou W: submitted to Microwave and Optical Technology Letters (2012).

[5] Teitelbaum M E, Nair R, O'Brien D J, et al: submitted to Optical Engineering (2010).

[6] Zhixian Hu, in: Fiber Optical and Fiber Cable Techniques. edtied by Publishing House of Electronics Industry, Beijing (2007).

[7] Jeong B, Lee S: OFC. Foru Forum Vol. m Vol. 1 (2003).

[8] Jianhua yang, Zhaohua Guo, Qing xiang, et al: submitted to Fiber Composites (1998).

[9] Xiaohong Shi: submitted to Optical Fiber Communication (2001).

[10] IPC-TM-650 TEST METHODS MANUAL.