Effects of P Addition on the Oxidation and Corrosion Behavior of Sn-9Zn-1Bi Solder Alloy

Hui Zhen Huang; Xiu Qin Wei; Lang Zhou

doi:10.4028/www.scientific.net/AMR.785-786.63

Paper Titles

Study on Corrosion Inhibition of Glutaraldehyde for 304 Stainless Steel in Simulated Cooling Water Containing Sulfate-Reducing Bacteria
p.38

Research on the Si-Ti High Temperature Oxidation-Resistant Coatings for Tantalum Alloys
p.45

Thermal Non-Destructive Testing for the Titanium Implants
p.52

Investigation on Efficient Vanadium Extraction from Vanadium-Bearing Molten Iron
p.58

Effects of P Addition on the Oxidation and Corrosion Behavior of Sn-9Zn-1Bi Solder Alloy
p.63

Effects of Grain Refiner and Cooling Rate on Solidification Structure of H62 Brass
p.67

Low Cycle Fatigue Study of 63Sn-37Pb Solder under Torsional Cyclic Loading
p.72

Effects of Trace ZrC on the Microstructure and Properties of Molybdenum Alloy
p.76

Simulation of the Elastic Modulus of Mo Alloys at Both Room and High Temperatures
p.81

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 785-786Effects of P Addition on the Oxidation and...

Effects of P Addition on the Oxidation and Corrosion Behavior of Sn-9Zn-1Bi Solder Alloy

Abstract:

The oxidation and corrosion behavior of Sn-9Zn-1Bi lead-free solder alloys with different P content were investigated by weighing the mass of the alloy, as well as the effects of P on the microstructure. The results indicate that the oxidation resistance and the corrosion resistance of Sn-9Zn-1Bi solder alloy can be enhanced significantly with the increase of P content. The microstructure observations show that P addition into Sn-9Zn-1Bi solder alloy can refine the microstructure and the numbers of dark rod-like Zn-rich phases are decreased with increasing of P addition.

You might also be interested in these eBooks

Current Trends in the Development of Industry

View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 785-786)

Pages:

63-66

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.785-786.63

Citation:

Cite this paper

Online since:

September 2013

Authors:

Hui Zhen Huang*, Xiu Qin Wei, Lang Zhou

Keywords:

Corrosion, Lead-Free Solder Alloy, Microstructure, Oxidation, Sn-9Zn-1Bi

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

* - Corresponding Author

References

[1] J. L. Bi, A. M. Hu, J. Hu, Effects of Cr additions on interfacial reaction between the Sn-Zn-Bi solder and Cu/electroplated Ni substrates, Microelectron. Reliab. 51 (2011) 636-641.

DOI: 10.1016/j.microrel.2010.09.028

Google Scholar

[2] M. Abtew, G. Selavaduray, Lead-free solders in microelectronics Mater Sci. and Eng. 27 (2000) 95-141.

Google Scholar

[3] K. L. Lin, C. L. Shih, Wetting interaction between Sn-Zn-Ag solders and Cu, J. Electron. Mater. 32 (2003) 95-100.

DOI: 10.1007/s11664-003-0242-8

Google Scholar

[4] K. Suganuma, Advances in lead-free electronics soldering, Curr. Opin. Solid State Mater. Sci. 5(2001) 55-64.

Google Scholar

[5] C. M. L. Wu, C. M. T. Law, D. Q. Yu, The wettability and microstructure of Sn-Zn-RE alloys, J. Electron. Mater. 32(2003) 63-69.

Google Scholar

[6] A. Sharif, Y. C. Chan, Effect of substrate metallization on interfacial reactions and reliability of Sn-Zn-Bi solder joints, Microelectron. Eng. 84(2007) 328-335.

DOI: 10.1016/j.mee.2006.10.087

Google Scholar

[7] J. Zhou, Y. Sun, F. Xue, Properties of low melting point Sn-Zn-Bi solders, J. Alloys Compd. 397(2005) 260-264.

DOI: 10.1016/j.jallcom.2004.12.052

Google Scholar

[8] L.L. Fang, J. Zhou, F. Xue, Y. S. Sun, High-temperature oxidation behavior of Sn-8Zn-3Bi-P and its effect on properties, Trans. China Weld. Inst. 29(2008) 89-96.

Google Scholar

[9] Y. S. Kim, K. S. Kim, C. W. Hwang, Effect of composition and cooling rate on microstructure and tensile properties of Sn-Zn-Bi alloys, J. Alloys Compd., 352(2003) 237-245.

DOI: 10.1016/s0925-8388(02)01168-4

Google Scholar