Electrical Behavior of SiCp Reinforced Copper Matrix Composites by Hot Pressing

Chang Chun Wang; Guang Hui Min; Suk Bong Kang

doi:10.4028/www.scientific.net/AMR.79-82.1579

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Characterization of Wear Performance of Micro-Plasma Surface Hardened Layer
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Synthesis and Characterization of Highly Branched Poly(urethane-imide)s
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Electrical Behavior of SiCp Reinforced Copper Matrix Composites by Hot Pressing
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Electrical Behavior of SiCp Reinforced Copper Matrix Composites by Hot Pressing

Abstract:

SiCp reinforced copper matrix composites with the reinforcement content of 30-50vol. % were fabricated by hot pressing using Cu-coated and uncoated SiC powder. And the microstructure and electrical conductivity of the composites were also studied. The results showed that with the increasing of SiCp particle size, the electrical conductivity of the composites also increased. And the oxides in the composites can decrease the electrical conductivity of the composites obviously. The electrical conducting property of the composites can be improved by the copper coating layer and suitable annealing treatment. It provided important data for the application of SiCp/Cu composites as electronic packaging materials.