Study on Thermal Cycling of Sn0.7Cu Solder

Li Yang; Ju Li Li; Jing Guo Ge; Meng Li; Nan  Ji

doi:10.4028/www.scientific.net/AMR.791-793.362

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 791-793Study on Thermal Cycling of Sn0.7Cu Solder

Study on Thermal Cycling of Sn0.7Cu Solder

Abstract:

Thermal cycling of a unit Sn0.7Cu solder was studied based on the steady-state creep constitutive equation and Matlab software. The results show that there is a steady-state cycle for the thermal cycling of unit Sn0.7Cu eutectic solder. In steady-state thermal cycling, the shear stress is increased with the increase of temperature. There is a stage of stress relaxation during high temperature. A liner relationship between maximum shear stress and maximum shear strain is observed during thermal cycling. The metastable cycle number is declined greatly with the increase of maximum shear strain.

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Periodical:

Advanced Materials Research (Volumes 791-793)

Pages:

362-365

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.791-793.362

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Online since:

September 2013

Authors:

Li Yang, Ju Li Li, Jing Guo Ge, Meng Li, Nan Ji

Keywords:

Constitutive Equation, Solder, Strain, Stress, Thermal Cycling

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