Fabrication of Cu-SiCp Composites via the Electroless Copper Coating Process for the Electronic Packaging Applications

K. Azmi; Mohd Mustafa Al Bakri Abdullah; M.A.A. Mohd Salleh

doi:10.4028/www.scientific.net/AMR.795.272

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 795Fabrication of Cu-SiCp Composites via the...

Fabrication of Cu-SiC_p Composites via the Electroless Copper Coating Process for the Electronic Packaging Applications

Abstract:

Silicon carbide reinforced copper matrix (Cu-SiC_p) composites are highly rated as thermal management materials due to their high thermal conductivity and low thermal expansion properties. However, the Cu-SiC_p composites fabricated via the conventional powder metallurgy methods have substandard properties due to the weak bonding between the copper matrix and the SiC_p reinforcement. In order to strengthen the bonding, the SiC_p were coated with copper via electroless coating process. Based on the experimental results, a continuous copper deposition on the SiC_p was obtained. The Cu-Coated layer improved the green strength of the composites thus allowed a high volume fraction of SiC_p to be incorporated into the copper matrix. However, the increase in the volume fraction of SiC_p has a significant effect on the apparent porosity of the Cu-SiC_p composites. Nevertheless, the porosity of the Cu-Coated Cu-SiC_p composites remained significantly lower than those of non-Coated Cu-SiC_p composites especially at high volume fraction of SiC_p.

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Periodical:

Advanced Materials Research (Volume 795)

Pages:

272-275

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.795.272

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Online since:

September 2013

Authors:

K. Azmi, Mohd Mustafa Al Bakri Abdullah, M.A.A. Mohd Salleh

Keywords:

Copper Matrix Composites, Electroless Copper, Powder metallurgy, Silicon Carbide (SiC)

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References

[1] S. Elomari, M. D. Skibo, A. Sundarrajan, H. Richards, Thermal expansion behavior of particulate metal-matrix composites, Compos. Sci. Technol. 58 (1998) 369-376.

DOI: 10.1016/s0266-3538(97)00124-3

Google Scholar

[2] L. C. Davis, B. E. Artz, Thermal conductivity of metal matrix composites, J. Appl. Phys. 77 (1995) 4954-4960.

DOI: 10.1063/1.359302

Google Scholar

[3] T. Schubert, A. Brendel, K. Schmid, T. Koeck, L. Ciupinski, W. Zielinski, B. Kieback, Interfacial design of Cu/SiC composites prepared by powder metallurgy for heat sink applications, Composites Part A 38 (2007) 2398-2403.

DOI: 10.1016/j.compositesa.2007.08.012

Google Scholar

[4] K. M. Shu, G. C. Tu, The microstructure and the thermal expansion characteristics of Cu/SiCp composites, Mater. Sci. Eng. A 349 (2003) 236-247.

DOI: 10.1016/s0921-5093(02)00788-8

Google Scholar

[5] R. M. German, Powder Metallurgy Science, Metal Powder Industries Federation, 1994.

Google Scholar

[6] R. Veleva, Role of potassium ferrocyanide in electroless copper baths, Surf. Coat. Technol. 29 (1986) 87-93.

DOI: 10.1016/0257-8972(86)90019-8

Google Scholar

[7] E. Norkus, A. Vaskelis, J. Jaciauskiene, Obtaining of high surface roughness copper deposits by electroless plating technique, Electrochim. Acta 51 (2006) 3495-3499.

DOI: 10.1016/j.electacta.2005.09.043

Google Scholar

[8] M. Oita, M. Matsuoka, C. Iwakura, Deposition rate and morphology of electroless copper film from solutions containing 2,2'-dipyridyl, Electrochim. Acta, 42 (1997) 1435-1440.

DOI: 10.1016/s0013-4686(96)00367-2

Google Scholar