Grinding Force and Surface Roughness in Ultrasonic Assisted Grinding of SiC Ceramics with Diamond Grinding Wheel

L.F. Liu; Fei Hu Zhang; Chun Hui  Li; Jiang Chen; Min Hui Liu

doi:10.4028/www.scientific.net/AMR.797.234

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 797Grinding Force and Surface Roughness in Ultrasonic...

Grinding Force and Surface Roughness in Ultrasonic Assisted Grinding of SiC Ceramics with Diamond Grinding Wheel

Abstract:

In this paper, experiments are conducted to study the characters of Ultrasonic Assisted Grinding (UAG) and Conventional Grinding (CG), diamond grinding wheel is used in experiments, grinding forces and surface roughness are measured in both UAG and CG. The effects of different parameters on grinding force, surface roughness and force ratio are discussed. The results show that the grinding force and surface roughness in UAG is smaller than those in CG. The force ratio in UAG is lower than that in CG, which reveals that the grinding wheel has a good wear-resistant property in UAG process.

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Periodical:

Advanced Materials Research (Volume 797)

Pages:

234-239

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.797.234

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Online since:

September 2013

Authors:

L.F. Liu, Fei Hu Zhang, Chun Hui Li, Jiang Chen, Min Hui Liu

Keywords:

Grinding Force, Silicon Carbide (SiC), Surface Roughness (SR), Ultrasonic Assisted Grinding (UAG)

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