Study on Chemical Mechanical Polishing Parameters of 6H-SiC Crystal Substrate Based on Diamond Abrasive

Abstract:

In this paper, according to the slurry ingredients obtained by former research, the influences of the chemical mechanical polishing (CMP) process parameters, such as the rotational velocity of the platen and the carrier, the polishing pressure and the abrasive size on the material removal rate (MRR) and surface roughness Ra have been studied in CMP SiC crystal substrate (0001) C and (0001) Si surface based on the diamond abrasive. The research results show that the material removal rate changes with the change of the abrasive size, the rotational velocity of the platen and the polishing pressure significantly, but the maximum of MRR can be obtained at a certain rotational velocity of platen, abrasive size and polishing pressure. The influence of the abrasive size, the platen velocity, the carrier velocity and the polishing pressure on surface roughness is no significant. Under the same conditions, the MRR of CMP the Si surface is larger than that of the C surface. This study results will provide the reference for optimizing the process parameters and researching the material removal mechanism in CMP SiC crystal substrate.

• Periodical: Advanced Materials Research (Volume 797)
• Pages: 261-265
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.797.261
• Online since: September 2013
• Authors: Jian Xiu Su, Zhu Qing Zhang, Jian Guo Yao, Li Jie Ma, Qi Gao Feng
• Keywords: Chemical Mechanical Polishing, Diamond Abrasive, Material Removal Rate (MRR), SiC Crystal Substrate, Surface Roughness (SR)

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DOI: 10.1088/1674-4926/31/5/056002