Research Progress of Slicing Method for Solar Silicon Wafer

Abstract:

Solar photovoltaic cell demand is great in the whole world and its manufacturing cost is also high. The main reason that slicing cost is too high, because of the low slicing efficiency and large kerf loss.Therefore, many scholars are studying new slicing method in order to reduce the cost. In this paper, we summarize conventional and new slicing method for solar silicon wafer, and think that new slicing method widely apply in photovoltaic industry, which needs to solve some technical problems. At present, multi-wire saw technology still is mainly slicing method in photovoltaic industry.

• Periodical: Advanced Materials Research (Volume 800)
• Pages: 191-195
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.800.191
• Online since: September 2013
• Authors: Jin Sheng Wang, Zi Fa Li, Wei Bing Wang
• Keywords: Slicing Method, Solar Silicon Wafer, Wire Saw

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