Super-Hydrophobic Film Fabricated on Copper with Electro-Deposition Method and its Corrosion Resistance

Peng Wang; Dun Zhang; Peng Ju

doi:10.4028/www.scientific.net/AMR.803.278

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 803Super-Hydrophobic Film Fabricated on Copper with...

Super-Hydrophobic Film Fabricated on Copper with Electro-Deposition Method and its Corrosion Resistance

Abstract:

Copper film with rough structure is prepared on metal surface via electro-deposition. After modification of tetradecanoic acid, copper film presents super-hydrophobic property with water contact angle of 151.1°, which could be attributed to the rough structure by trapping air. The adhesion test shows that the modified copper surface has low apparent water adhesion to the suspending droplet. Electrochemical measurement proves that super-hydrophobic film can inhibit corrosion of copper effectively. The method proposed in this paper is time-saving and facile to operate, and it offers a promising technique to prepare metallic surface with super-hydrophobic property.

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Periodical:

Advanced Materials Research (Volume 803)

Pages:

278-281

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.803.278

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Online since:

September 2013

Authors:

Peng Wang, Dun Zhang, Peng Ju

Keywords:

Copper, Corrosion, Electro-Deposition, Super-Hydrophobic

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