Picosecond Laser Micromachining of Ultra-Hard AlMgB₁₄ Thin Films

Abstract:

Ultra-hard AlMgB₁₄ (30-50 GPa) thin films were deposited on silicon substrate for a nominal thickness of 100 nm using a pulsed excimer laser and then subjected to direct micromachining using a 532 nm, 30 picosecond pulsed Nd:YAG laser. The application is targeted towards synthesizing an artificial nacre material composed of hexagonal bricks and particle bridges of superhard AlMgB₁₄ thin film and mortars of Ti thin film that biomimic the hierarchical architecture of natural nacre. The effects of pulse energy (0.1 to 1 μJ) and laser scanning speed (0.5 to 1.5 m/sec) on ablation depth and quality of scribed channels were evaluated. The morphology of the channels was characterized using confocal microscope and optical profilometer. Results indicated a clean material removal process characterized by absence of heat affected zone, high-speed scribing and small feature size. The energy fluence for the removal of 100 nm thin film without affecting the silicon substrate was 0.3 J/cm². An interesting observation is that particulate matter present in the thin film was not ablated suggesting a size effect. Analysis of thermal transport reveals that the material removal has occurred via spallation and phase explosion mechanisms. The picosecond laser thus offers a high-speed energy source for precisely ablating ultra-hard thin films that in turn will allow the potential for fabrication of novel artificial nacre with exceptional strength and toughness.

• Periodical: Advanced Materials Research (Volume 804)
• Pages: 17-22
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.804.17
• Online since: September 2013
• Authors: Ammar Melaibari, Pal Molian
• Keywords: Micro Machining, Picosecond Laser, Thin Film, Ultra-Hard Material

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