Curing Properties of UV-Cured Pressure Sensitive Adhesives

Jamarosliza Jamaluddin; Myung Cheon Lee

doi:10.4028/www.scientific.net/AMR.812.131

Paper Titles

Mechanical Properties of Rubber Toughened Polyester-Kenaf Composites under Active Environment
p.107

The Effect of Surface Modification on Physical Properties and Morphology of Oil Palm and Rice Husk Fibres
p.113

SIO₂ Filler as Interface Modifier in PMMA/ENR 50 Electrolytes
p.120

Thermal Properties and Crystallisation Behaviour of Thermoplastic Natural Rubber (TPNR) Nanocomposites
p.125

Curing Properties of UV-Cured Pressure Sensitive Adhesives
p.131

Aromatic and Epoxidised Oil Curing and Rebound Resilience Characteristic and their Humidity Effect of Hardness on NR Vulcanizates
p.138

Effect of Rice Husk Particle Size on Tensile and Density of Recycled PPVC Composite
p.145

Tensile Properties of Aminosilane Treated Rice Husk/ Recycled PVC Composite
p.151

Seam Puckering: Analysis and Modeling with Structural Equation Modeling
p.157

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 812Curing Properties of UV-Cured Pressure Sensitive...

Curing Properties of UV-Cured Pressure Sensitive Adhesives

Abstract:

In this study the effect of trimethylopropane triacrylate (TMPTA) content as a crosslinking agent on curing properties of UV-cured pressure sensitive adhesives (PSAs) was investigated. The curing properties were studied using gel fraction determination, photo-differential scanning calorimetry (photo-DSC) and Fourier transform infraredattenuated total reflection (FTIR-ATR) spectroscopy. Gel fraction sharply increased after expose to UV irradiation and increased with increasing TMPTA content. Moreover, the addition of TMPTA as crosslinking agent induced an earlier onset of auto acceleration and relative concentration of the C=C was not zero because they were trapped in the PSAs network.

You might also be interested in these eBooks

Progress in Polymer and Rubber Technology

View Preview

Info:

Periodical:

Advanced Materials Research (Volume 812)

Pages:

131-137

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.812.131

Citation:

Cite this paper

Online since:

September 2013

Authors:

Jamarosliza Jamaluddin, Myung Cheon Lee

Keywords:

FTIR-ATR, Gel Fraction, Photo-DSC, Pressure Sensitive Adhesives, Trimethylopropane Triacrylate

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] H.S. Joo, H.S. Do, Y.J. Park, H.J. Kim, Adhesion performance of UV-cured semi-IPN structure acrylic pressure sensitive adhesives, J. Adhes. Sci. Technol. 20 (2006) 1573 -1594

DOI: 10.1163/156856106778884271

Google Scholar

[2] T.E. Rolando, Solvent-free adhesives. RAPRA Technology Ltd. (1998).

Google Scholar

[3] C. Decker, I. Lorinczova, UV radiation curing waterborne acrylate coatings, J. Coat. Technol. Res. 1(2004), 247-256.

DOI: 10.1007/s11998-004-0027-x

Google Scholar

[4] Y.J. Park, D.H. Lim, H.J. Kim, H.S. Joo, H.S. Do, Curing performance of UV-curable styrene- isoprene-styrene-based pressure sensitive adhesive, J. Adhes. Sci. Technol 22 (2008) 1401-1423.

DOI: 10.1163/156856108x309549

Google Scholar

[5] C. Decker, Kinetic study of light-induced polymerization by real-time UV and IR spectroscopy, J. Polym. Sci. Part A: Polym. Chem. 30 (1992) 913-928.

DOI: 10.1002/pola.1992.080300523

Google Scholar

[6] C. Decker, F. Massona, R. Schwalmb, Weathering resistance of waterbased UV-cured polyurethane-acrylate coatings, Polym Deg. Stab. 83 (2004) 309-320.

DOI: 10.1016/s0141-3910(03)00276-3

Google Scholar

[7] A. Palanisamy, B.S. Rao, Photo-DSC and dynamic mechanical studies on UV curable compositions containing diacrylate of ricinoleic acid amide derived from castor oil, Prog.Org. Coat. 60 (2007) 161-169

DOI: 10.1016/j.porgcoat.2007.06.002

Google Scholar

[8] H.S. Joo, Y.J. Park, H.S. Do, H.J. Kim, S.Y. Song, K.Y. Choi, The curing performance of UV-curable semi-interpenetrating polymer network structured acrylic pressure-sensitive adhesives, J. Adhes. Sci. Technol. 21(2007) 575-588.

DOI: 10.1163/156856107781192346

Google Scholar

[9] J.F. Rabek, Mechanism of Photophysical process and photochemical reactions in Polymers,John Wiley & Sons Ltd., 1987.

Google Scholar

[10] Y.J. Park, D.H. Lim, H.J. Kim, D.S. Park, I.K. Sung, UV- and thermal-curing behaviors of dual-curable adhesives based on epoxy oligomers, Int. J. Adhes. Adhes. 29 (2009) 710-717.

DOI: 10.1016/j.ijadhadh.2009.02.001

Google Scholar