Nanofluids for Thermal Performance Improvement in Cooling of Electronic Device

S.S. Khaleduzzaman; Saidur Rahman; Jeyraj Selvaraj; I.M. Mahbubul; M.R. Sohel; I.M. Shahrul

doi:10.4028/www.scientific.net/AMR.832.218

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 832Nanofluids for Thermal Performance Improvement in...

Nanofluids for Thermal Performance Improvement in Cooling of Electronic Device

Abstract:

Nanofluid is a promising coolant for high-heat dissipation electronics device or system. The effect of nanofluids as thermal performances on a rectangular shape microchannel heat sink (MCHS) is analytically studied. Al₂O₃, SiC, and CuO nanoparticles dispersing in water were considered for analysis. A steady, laminar, and incompressible flow with constant heat flux was assumed in the channel. Nanofluids with concentrations of 0.5 to 4.0 vol. % were analyzed at two different inlet velocities of 0.5 m/s and 3.0 m/s. The results showed that highest thermal conductivity enhancement was 12.45% by using SiC-water nanofluids. In the case of Al₂O₃-water and CuO-water nanofluids maximum improvement were 11.98% and 11.36%, respectively for 4.0 vol. % of nanoparticle concentration. Furthermore, nanofluids as a coolant instead of water showed a highest improve of heat flux 8.51% for water-CuO, and 6.44% and 5.60% increase for Al₂O₃-water and SiC-water, respectively. The maximum pumping power found 0.33 W at 3 m/s and 0.0091 W at 0.5 m/s for the same concentration of 4.0 vol. % for all of these nanofluids.

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Periodical:

Advanced Materials Research (Volume 832)

Pages:

218-223

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.832.218

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Online since:

November 2013

Authors:

S.S. Khaleduzzaman, Saidur Rahman, Jeyraj Selvaraj, I.M. Mahbubul, M.R. Sohel, I.M. Shahrul

Keywords:

Cooling, Micro-Channel, Nanofluid, Pumping Power, Thermal Performance

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References

[1] P. Selvakumar, S. Suresh, Convective performance of CuO/water nanofluid in an electronic heat sink, Exper. Therm. Fluid Sci. 40 (2012) 57-63.

DOI: 10.1016/j.expthermflusci.2012.01.033

Google Scholar

[2] S.U.S. Choi, Developments and applications of non-newtonian flows, ASME FED 231 (66) (1995) 99-103.

Google Scholar

[3] C.T. Nguyen, G. Roy, C. Gauthier, N. Galanis, Heat transfer enhancement using Al2O3–water nanofluid for an electronic liquid cooling system, App. Therm. Eng. 27 (8–9) (2007) 1501-1506.

DOI: 10.1016/j.applthermaleng.2006.09.028

Google Scholar

[4] X.L. Xie, W.Q. Tao, Y.L. He, Numerical study of turbulent heat transfer and pressure drop characteristics in a water-cooled minichannel heat sink, J. Electron. Pack., Transactions of the ASME 129 (2007) 247-255.

DOI: 10.1115/1.2753887

Google Scholar

[5] M.R. Sohel, R. Saidur, M.F.M. Sabri, M. Kamalisarvestani, M.M. Elias, A. Ijam, Investigating the heat transfer performance and thermophysical properties of nanofluids in a circular micro-channel, Int. Commun. Heat Mass Trans. 42 (2013) 75-81.

DOI: 10.1016/j.icheatmasstransfer.2012.12.014

Google Scholar

[6] C.J. Ho, L.C. Wei, Z.W. Li, An experimental investigation of forced convective cooling performance of a microchannel heat sink with Al2O3/water nanofluid, App. Therm. Eng. 30 (2010) 96-103.

DOI: 10.1016/j.applthermaleng.2009.07.003

Google Scholar

[7] R.L. Hamilton, O.K. Crosser, Thermal Conductivity of Heterogeneous Two-Component Systems, Ind. Eng. Chem. Fund. 1(1962) 187-191.

DOI: 10.1021/i160003a005

Google Scholar

[8] H. Brinkman, The viscosity of concentrated suspensions and solutions, J. Chem. Phys. 20 (1952) 571.

Google Scholar

[9] B.C. Pak, Y.I. Cho, Hydrodynamic and heat transfer study of dispersed fluids with submicron metallic oxide particles, Exper. Heat Trans. 11 (1998) 151-170.

DOI: 10.1080/08916159808946559

Google Scholar

[10] Y. Xuan, W. Roetzel, Conceptions for heat transfer correlation of nanofluids, Int. J. Heat Mass Trans. 43 (2000) 3701-3707.

DOI: 10.1016/s0017-9310(99)00369-5

Google Scholar

[11] P. Kasten, S. Zimmermann, M.K. Tiwari, B. Michel, D. Poulikakos, Hot water cooled heat sinks for efficient data center cooling: towards electronic cooling with high exergetic utility, Fron. Heat Mass Trans. 1 (2010) 023006.

DOI: 10.5098/hmt.v1.2.3006

Google Scholar

[12] X.F. Peng, G.P. Peterson, Convective heat transfer and flow friction for water flow in microchannel structures, Int. J. Heat Mass Trans. 39 (1996) 2599-2608.

DOI: 10.1016/0017-9310(95)00327-4

Google Scholar

[13] T.-C. Hung, W.-M. Yan, W.-P. Li, Analysis of heat transfer characteristics of double-layered microchannel heat sink, Int. J. Heat Mass Trans. 55 (2012) 3090-3099.

DOI: 10.1016/j.ijheatmasstransfer.2012.02.038

Google Scholar

[14] X.L. Xie, Z.J. Liu, Y.L. He, W.Q. Tao, Numerical study of laminar heat transfer and pressure drop characteristics in a water-cooled minichannel heat sink, App. Therm. Eng. 29 (2009) 64-74.

DOI: 10.1016/j.applthermaleng.2008.02.002

Google Scholar