Optimal Design of Cooling Device for High Power LED Headlamp

Chun Zhang; Yi Xi Cai; Jing Wang; Xiao Hua Li; Xin Jie Zhao

doi:10.4028/www.scientific.net/AMR.834-836.1648

Paper Titles

Testing and Evaluation of Baby Walkers Based on Product Injury Data
p.1628

Research on the Maintainability Analysis and Design for Artillery Projectiles
p.1632

Manufacture of Nb₃Al Short Wires by RHQT Method Using a Newly Designed Apparatus
p.1638

A Protection Scheme for Standard Equipment to Avoid Harmful Random Large Current
p.1642

Optimal Design of Cooling Device for High Power LED Headlamp
p.1648

An Integrated Approach to Index Weight Based on Improved D-S Evidence Theory and Application of the Product Solution Evaluation
p.1654

The Research of Public Rental System with Electric Car
p.1659

Analysis on Apparel Marker Making's Technical Requirements and its Influencing Factors
p.1663

Design of Holes Distance Adjustable Device of Duckbill Seeder
p.1668

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 834-836Optimal Design of Cooling Device for High Power...

Optimal Design of Cooling Device for High Power LED Headlamp

Abstract:

The aim of this study is to optimize the cooling device for high power LED headlamp. The feasibility of using SMD (Surface Mounted Devices) resistor instead of LED chips has been analyzed by FloEFD and the relationship between temperature and total input power has been found. In order to evaluate the cooling performance of the heat pipe, two different arrangement forms has been used. Based on the simulation, heat pipe arranged in rectangle can satisfy the requirement of high-power LED headlamp. These results also laid a theoretical foundation for later experiments.

You might also be interested in these eBooks

Research in Materials and Manufacturing Technologies

View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 834-836)

Pages:

1648-1653

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.834-836.1648

Citation:

Cite this paper

Online since:

October 2013

Authors:

Chun Zhang*, Yi Xi Cai, Jing Wang, Xiao Hua Li, Xin Jie Zhao

Keywords:

Heat Pipe, Junction Temperature, LED Headlamp, Optimal Design

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

* - Corresponding Author

References

[1] Maydanik Y F. Loop heat pipes [J]. Applied Thermal Engineering, 2005, 25 (5/6) 635-57.

DOI: 10.1016/j.applthermaleng.2004.07.010

Google Scholar

[2] M.W. Shin, Thermal design of high-power LED package and system, Proc. SPIE6355 (2006) 9-21.

Google Scholar

[3] Liu-Lin Yuan, Sheng Liu, et al. Thermal analysis of high power LED array packaging with micro channel cooler[J]. Semiconductor Optoelectronics, 2006, 27 (6) : 712-716.

Google Scholar

[4] Cheng J H, Liu C K, Chao YL, et al. Cooling performance of silicon-based thermoelectric device on high power LED[A]. 24th International Conference on thermoelectric[C]. 2005, 53-56.

DOI: 10.1109/ict.2005.1519885

Google Scholar

[5] Wei Chen, X.B. Luo. Experimental Investigation on Micro Jet Cooling System for High Power LED[J] . Semconductor optoelectronics, 2007, 28 (4) : 478-481.

Google Scholar

[6] X. B. Luo, S. Liu, X. P. Jiang, T. Cheng. Experiment and numerical study on a micro jet cooling solution for high power LEDs, Science in China Series E-Technological Sciences, 37(9), pp.1194-1204, August, (2007).

DOI: 10.1007/s11431-007-0028-y

Google Scholar

[7] X.Y. Lu, Zezhao Hua, Yuanlai Xie. Thermal analysis of loop heat pipe used for high power LED [J]. Power and Electron Technology, 2009, 43(3): 73-74.

Google Scholar

[8] X.Y. Lu, Yuanxia Chen, M.J. Liu. The testing of a loop heat pipe cooling device for high power illumination LED[J]. Semiconductor Optoelectronics, 2008, 29 (5): 651-654.

Google Scholar

[9] W.F. Dai, J. Wang, Y.S. Li. Transient thermal analysis of high-power LED package［J］. Semiconductor Optoelectronics, 2008, 29 (3): 324～328.

Google Scholar

[10] Z.W. Tang，Q. Huang, Z.L. Zhao et al. An integrated high-power LED refrigerated by semiconductor [J]. Semiconductor Optoelectronics, 2007, 28 (4): 471～473, 543.

Google Scholar