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Optimal Design of Cooling Device for High Power LED Headlamp

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Abstract:

The aim of this study is to optimize the cooling device for high power LED headlamp. The feasibility of using SMD (Surface Mounted Devices) resistor instead of LED chips has been analyzed by FloEFD and the relationship between temperature and total input power has been found. In order to evaluate the cooling performance of the heat pipe, two different arrangement forms has been used. Based on the simulation, heat pipe arranged in rectangle can satisfy the requirement of high-power LED headlamp. These results also laid a theoretical foundation for later experiments.

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Periodical:

Advanced Materials Research (Volumes 834-836)

Pages:

1648-1653

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.834-836.1648

Citation:

Cite this paper

Online since:

October 2013

Authors:

Chun Zhang*, Yi Xi Cai, Jing Wang, Xiao Hua Li, Xin Jie Zhao

Keywords:

Heat Pipe, Junction Temperature, LED Headlamp, Optimal Design

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© 2014 Trans Tech Publications Ltd. All Rights Reserved

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