Analysis of the Research Status of Tin Whisker's Influence on Lead-Free Soldering

Qing Ru Lu; Hui Huang; De Bing Chen

doi:10.4028/www.scientific.net/AMR.834-836.876

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 834-836Analysis of the Research Status of Tin Whisker's...

Analysis of the Research Status of Tin Whisker's Influence on Lead-Free Soldering

Abstract:

Strengthening the study on whiskers influence on the reliability of lead-free soldering can improve welding technology and contribute to the overall development of the electronics industry. This paper provides an overview of the study on lead-free solder technology and development, summaries the materials, processes and other reliability issues and welding reliability problems of lead-free solder, finally gives an overview of the research status of whiskers formation mechanism and reliability.

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Periodical:

Advanced Materials Research (Volumes 834-836)

Pages:

876-879

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.834-836.876

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Online since:

October 2013

Authors:

Qing Ru Lu, Hui Huang, De Bing Chen

Keywords:

Lead-Free Solder, Lead-Free Soldering, Tin Whiskers

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