Lifetime Prediction for Power IGBT Modules in Metro Traction Systems

Abstract:

In this work, the methodology and procedures of lifetime prediction for power IGBT modules are presented. Firstly, we discuss the long term reliability tests of power modules for developing lifetime models, and review some reported lifetime models. Then, the procedures of lifetime prediction in real applications are addressed, which include power loss calculations based on the actual mission profile, the conversion of power loss profile to temperature profile according to the module's thermal properties, the temperature cycles counting by Rainflow algorithm, and lifetime calculation by the fatigue linear accumulation damage theory. Finally, the lifetime of a 3300V/800A IGBT module manufactured by Dynex Semiconductor of China Southern Railway applied in metro traction systems is predicted.

• Periodical: Advanced Materials Research (Volumes 846-847)
• Pages: 724-731
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.846-847.724
• Online since: November 2013
• Authors: Yan Gang Wang*, Dinesh Chamund, Shi Ping Li, Kevin Wu, Steve Jones, Gary Liu
• Keywords: Failure, IGBT Module, Lifetime Prediction, Power Cycling Test, Reliability

References

[1] M. Ciappa, Selected failure mechanisms of modern power modules, Microelectronics Reliability, vol. 42, p.653–667, (2002).

DOI: 10.1016/s0026-2714(02)00042-2

[2] T. Stockmeier, From packaging to Un-Packaging–Trends in power semiconductor modules, Power Semiconductor Devices and IC's, 20th Intern. Symposium, ISPSD, p.12–19, May, (2008).

DOI: 10.1109/ispsd.2008.4538886

[3] A. Christmann, M. Thoben, K. Mainka, Reliability of Power Modules in Hybrid Vehicles, PCIM Europe , p.359–366, May, (2009).

[4] J. Lutz, H. Schlangenotto, U. Scheuermann and R. D. Doncker, Semiconductor Power Devices, Physics, Characteristics, Reliability, p.380–409, Springer-Verlag Berlin Heidelberg, (2011).

DOI: 10.1007/978-3-642-11125-9

[5] S. S. Manson, Thermal stress and low cycle fatigue, New York: McGraw-Hill, (1966).

[6] M. Held, P. Jacob, G. Nicoletti, P. Scacco and M. H. Poech, Fast Power Cycling Test for IGBT Modules in Traction Application, Power Electronics and Drive Systems, p.425–430, May (1997).

DOI: 10.1109/peds.1997.618742

[7] I. F. Kovacevic, U. Drofenik and J. K. Wolar, New Physical Model for Lifetime Estimation of Power Modules, Intern. Power Electronics Conference (IPEC), p.2106–2114, Jun. (2010).

DOI: 10.1109/ipec.2010.5543755

[8] K. C. Norris and A. H. Landzberg, Reliability of controlled collapse interconnections, IBM Journal of Research and Development, vol. 13, no. 3, p.266–271, May (1969).

DOI: 10.1147/rd.133.0266

[9] R. Bayerer, T. Herrmann, T. Lutz, J. Lutz, M. Feller, Model of power cycling lifetime of IGBT Modules - Various Factors Influencing lifetime, Integrated Power Systems (CIPS), Mar. (2008).

[10] Y. Wang, S. Jones, D. Chamund and G. Liu, Lifetime modeling of IGBT modules subjected to power cycling tests, PCIM Europe, p.802–809, May, (2013).

[11] G. Coquery, S. Carubelli, J. P. Ousten, R. Lallemand, F. Lecoq, D. Lhotellier, V. de Viry and Ph. Dupuy, Power module lifetime estimation from chip temperature direct measurement in an automotive traction inverter, Microelectronics Reliability, vol. 41, no. 9–10, p.1695–1700, (2001).

DOI: 10.1016/s0026-2714(01)00197-4

[12] M. A. Miner. Cumulative Damage in Fatigue, J. Applied Mechanics, 12, A159–A164, (1945).

DOI: 10.1115/1.4009458

[13] M. Matsuishi and T. Endo, Fatigue of metals subjected to varying stress- Fatigue lives under random loading, Proc. of the Kyushu District Meeting, p.37–40, (1968).

[14] DIM800NSM33-F000, Single Switch IGBT Module, http: /www. dynexpowersemiconductors. com/product-area/igbt-modules, Sep. (2012).