Reason Analysis and Repair Measures of Cracked Die

Jing Wang; Yong Wang

doi:10.4028/www.scientific.net/AMR.850-851.296

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 850-851Reason Analysis and Repair Measures of Cracked Die

Reason Analysis and Repair Measures of Cracked Die

Abstract:

The stress nephogram was obtained through analyzing the stress of die using the finite element software. Cause of die crack is determined from the stress nephogram, and repair plan is presented. The repair plan is analyzed by finite element and is validated by experiment.

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Periodical:

Advanced Materials Research (Volumes 850-851)

Pages:

296-299

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.850-851.296

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Online since:

December 2013

Authors:

Jing Wang*, Yong Wang

Keywords:

Crack, Die, HyperMesh, LS-DYNA, Strength Limit

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