Research on Fretting Performance of Silver Conducting Adhesive

Article Preview

Abstract:

Fretting is one of the main reasons for electric contact failure. Metal contact pairs have long been used, generally with the structure of copper alloy base, Ni interlayer and surface noble metal (such as gold) plating. The influences of plating material and plating thickness on fretting property have been researched deeply, meanwhile, new materials have been tried. In this paper, a new conductive material, silver conducting adhesive is used as the surface coating of contact pair, and a series of tests have been done to study the performance of fretting wear by compare with the coupons without silver conducting adhesive. The results show that the use of silver conductive adhesive improves the fretting property of electrical contacts, especially with small normal force.

You might also be interested in these eBooks

Info:

Periodical:

Advanced Materials Research (Volumes 875-877)

Pages:

434-439

Citation:

Online since:

February 2014

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2014 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] Xue-Yan Lin, Liang-Jun Xu, Yan-Chao Shao. Research on fretting resistance and fretting wear property of Ni-Au contact pair. Proceedings of the 57th IEEE Holm Conference on Electrical Contacts, pp: 86-91, (2011).

DOI: 10.1109/holm.2011.6034785

Google Scholar

[2] S. Noel, D. Allamarguy, S. Correia. Fretting behavior of nickel coatings for electrical contact applications. Proceedings of the 57th IEEE Holm Conference on Electrical Contacts, pp: 1-8, (2011).

DOI: 10.1109/holm.2011.6034784

Google Scholar

[3] Xin Wang, Xueyan Lin, Weimin Yang. The research of the gold plating product's fretting characteristic. 2006 IEEE International Conference on Information Acquisition. Wei-Hai China, August 20-23.

DOI: 10.1109/wcica.2008.4592865

Google Scholar

[4] Yu Yonezawa, Noboru Wakatsuki. Influence of small slide vibration over Au-Au electric contact phenomenon. Proceedings of the 49th IEEE Holm Conference on Electrical Contacts, pp.65-69, (2003).

DOI: 10.1109/holm.2003.1246480

Google Scholar

[5] M. Braunovic, M. Trudeau. Contact resistance behavior of nanocrystalline copper and palladium films under fretting conditions. Proceedings of the 41th IEEE Holm Conference on Electrical Contacts, pp.71-82, (1995).

DOI: 10.1109/holm.1995.482862

Google Scholar