Study on Interfacial Bonding Strength of SiO2/PET Composite Packaging Film

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Abstract:

SiO2/PET composite packaging film was prepared by depositing SiO2 on PET film substrates through magnetron sputtering technology. The state of SiO2 particles and its dispersion properties in PET substrates were characterized by scanning electron microscope (SEM) and bonding strength tester. The effects of the sputtering process parameters and intermediate layer on the bonding strength of the coating-substrate system were investigated. Results show that the bonding strength of coating-substrate system firstly increases and then decreases with the increase of sputtering process parameters. It is up to a maximum at the argon flow of 10 mL/min, radio-frequency power of 250 W and sputtering time of 70 min; and it is 0.14 MPa, 0.22 MPa and 0.19 MPa, respectively. The bonding strength of coating-substrate system increases with the increasing background pressure. Meanwhile, we find that the bonding strength of coating-substrate system is improved by depositing A12O3 intermediate layer between SiO2 film and PET substrates.

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Advanced Materials Research (Volumes 881-883)

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882-888

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January 2014

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© 2014 Trans Tech Publications Ltd. All Rights Reserved

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