Numerical Simulation of Film Thickness Uniformity Deposited by Planar Circular Magnetron Sputtering System

Qing Xiao Zhou; Chao Yang Wang; Zhi Bing Fu; Yong Jian Tang

doi:10.4028/www.scientific.net/AMR.887-888.743

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 887-888Numerical Simulation of Film Thickness Uniformity...

Numerical Simulation of Film Thickness Uniformity Deposited by Planar Circular Magnetron Sputtering System

Abstract:

There exist angular offset and eccentricity between target and substrate in most practical multi-target magnetron sputtering systems, which should be seriously considered when we calculate the film distribution. This simulation results suggested that excellent thickness uniformity can be obtained when increased the substrate-target distance, angular offset, and eccentricity, but decreased the film thickness simultaneously. However, superior uniformity films without reducing the thickness remarkably can also obtained when the geometry configuration are proper configured.

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Periodical:

Advanced Materials Research (Volumes 887-888)

Pages:

743-748

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.887-888.743

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Online since:

February 2014

Authors:

Qing Xiao Zhou, Chao Yang Wang, Zhi Bing Fu, Yong Jian Tang*

Keywords:

Magnetron Sputtering, Numeric Simulation, Uniformity

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* - Corresponding Author

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