Analysis of Residual Stress-Texture Relationships in Thin Films

Matteo Ortolani; Cristy Leonor Azanza Ricardo; Paolo Scardi

doi:10.4028/www.scientific.net/AMR.89-91.425

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 89-91Analysis of Residual Stress-Texture Relationships...

Analysis of Residual Stress-Texture Relationships in Thin Films

Abstract:

A new software was developed for the X-ray stress analysis of textured materials, especially useful in the case of thin films and coating. Literature data for a sputtered Cu thin film were used as a test case. Good agreement with the published results was found considering a grain interaction mechanism based on the combination of four models (Ruess/Voigt/Vook-Witt/inverse Vook-Witt). A similar value for the in-plane residual stress was obtained by the Eshelby-Kröner model, by optimizing the grain aspect-ratio. Main features and numerical/graphic output are briefly discussed.

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Periodical:

Advanced Materials Research (Volumes 89-91)

Pages:

425-430

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.89-91.425

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Online since:

January 2010

Authors:

Matteo Ortolani, Cristy Leonor Azanza Ricardo, Paolo Scardi

Keywords:

Grain Interaction, Residual Stress, Texture, Thin Film, X-Ray Diffraction (XRD)

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