Analysis of Residual Stress-Texture Relationships in Thin Films

Abstract:

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A new software was developed for the X-ray stress analysis of textured materials, especially useful in the case of thin films and coating. Literature data for a sputtered Cu thin film were used as a test case. Good agreement with the published results was found considering a grain interaction mechanism based on the combination of four models (Ruess/Voigt/Vook-Witt/inverse Vook-Witt). A similar value for the in-plane residual stress was obtained by the Eshelby-Kröner model, by optimizing the grain aspect-ratio. Main features and numerical/graphic output are briefly discussed.

Info:

Periodical:

Advanced Materials Research (Volumes 89-91)

Edited by:

T. Chandra, N. Wanderka, W. Reimers , M. Ionescu

Pages:

425-430

DOI:

10.4028/www.scientific.net/AMR.89-91.425

Citation:

M. Ortolani et al., "Analysis of Residual Stress-Texture Relationships in Thin Films", Advanced Materials Research, Vols. 89-91, pp. 425-430, 2010

Online since:

January 2010

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Price:

$35.00

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