Effect of Packaging Materials on the Reliability of LED Modules under High Temperature Aging Test

Wen Jing Xiang; Lei Nie; Hua Jing Li; Fei Huang

doi:10.4028/www.scientific.net/AMR.915-916.532

Paper Titles

Influence of Superficial Modification of Steels by Materials with Effect of Memory of the Form on Wear-Fatigue Characteristics at Frictional-Cyclic Loading
p.509

Study of Chemical Control Synthesis on Aluminum Salt Flame Retardants Powders
p.515

The Application of CFZ-Si Monocrystal Material in Photovoltaic Field
p.519

Generation Review on the Production Line Development of Foam Glass at Home and Abroad
p.524

Effect of Packaging Materials on the Reliability of LED Modules under High Temperature Aging Test
p.532

New Material Research of 200°C Ultra-High Temperature Fluid in Hydraulic Fracturing Industry Design Technology
p.536

Controllable Synthesis of ZnO Nanostructures via Template-Free Electrochemical Deposition at Low Temperature and their Optical Properties
p.540

External Potential Dynamics Simulation of Morphological Transitions in Diblock Copolymer Melt under an Electric Field
p.545

Fiber Materials AC Impedance Spectroscopy and its Application
p.549

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 915-916Effect of Packaging Materials on the Reliability...

Effect of Packaging Materials on the Reliability of LED Modules under High Temperature Aging Test

Abstract:

Phosphor and silicone are common used packaging materials in LED fabrication and have great influence on the reliability of LED modules. In order to understand the effect of these materials, test LED samples were prepared with different sets of packaging materials. An aging test at a constant temperature of 125°C was performed to discover the failure process. The results of aging test shown that the luminance of all samples fell obviously. But the luminance decrease of samples without phosphor and silicone was the least. As to other samples, the carbonization of silicone and the consequent bubbles reduced the luminance rapidly. And the phosphor had the similar influence on the luminance. If phosphor and silicone were used at the same time, the luminance would reduce quickly and then the modules would fail.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 915-916)

Pages:

532-535

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.915-916.532

Citation:

Cite this paper

Online since:

April 2014

Authors:

Wen Jing Xiang, Lei Nie*, Hua Jing Li, Fei Huang

Keywords:

Aging Test, Failure, LED, Luminance, Packaging Materials

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

* - Corresponding Author

References

[1] Ming Gong, Xiaosong Ma and Daoguo Yang, et al: Reliability Assessment for LED Luminaires Based on Step-Stress Accelerated Life Test, Proceeding of ICEPT&HDP (2012) , pp.1546-1549.

DOI: 10.1109/icept-hdp.2012.6474901

Google Scholar

[2] Chen Zhaohui, Zhang Qin and Wang Kai: Reliability test and failure analysis of high power LED packages", Journal of Semiconductors(2011), 32(1), pp.53-56.

Google Scholar

[3] Wei-Hao Chi, Tsung-Lin Chou, Cheng-Nan Han, and Kuo-Ning Chiang: Analysis of Thermal Performance of High Power Light Emitting Diodes Package, Proceeding of 10th EPTC(2008), pp.533-538.

DOI: 10.1109/eptc.2008.4763488

Google Scholar

[4] Tian Chuanjun: Temperature Effect on the Photoelectric Parameter of High-power LED illumination System, Chinese Journal of Luminescence, Vol. 31, No. l(2010).

Google Scholar

[5] Lei Liu and Daoguo Yang: Thermal performance analysis of photoelectric parameters on high-power LEDs packaging modules, Proceeding of 12th ICTMMS(2011).

DOI: 10.1109/esime.2011.5765842

Google Scholar

[6] Steranka, F. M: High power LEDs - Technology status and market applications, Physical Status Solidi (a), Vol. 194, No. 2 (2002), pp.380-388.

Google Scholar