Structural Design and Analysis of Abrasive Disk for Biplane of Multiple Workpieces

Abstract:

The planetary lapping is an effective method to improve the precision and efficiency, to obtain the ideal grinding trajectory by changing the planetary structure on the basis of the traditional abrasive mechanism. In order to grinding double plane of multi workpieces at the same time, first the design specific analyze the trajectory, Then, the planetary grinding structure is designed according to the processing requirements, and finally, the trajectory of the lapping is simulated by the kinematics and geometry, in order to verify its availability. The grinding machine is not only has a high machining accuracy and machining quality, but also is simultaneously used in the multiple workpieces having different cross-section within a certain size, in addition, it improves the processing efficiency and reduces processing costs. tables etc.

• Periodical: Advanced Materials Research (Volume 940)
• Pages: 144-147
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.940.144
• Online since: June 2014
• Authors: Pei Ying Bian*
• Keywords: Kinematic Simulation, Planetary Lapping, Structure Design

References

[1] Su J X, Guo D M, Kang R K, etc. Modeling and Analyzing on Nonuniformity of Materia Removal in Chemical Mechanical Polishing of Silicon Wafer[J]. Science Material Forum, 2004, 471~472: 26~31.

DOI: 10.4028/www.scientific.net/msf.471-472.26

[2] Wang Jun, Sun Jun, Yang Xinwei. Research on motion crystal planetary polishing machine simulation[J]. Machinery design and manufacture, 2000 (2) : 55256.

[3] Wu Hongji, Cao Lixin, Liu Jian. Analysis of kinematic geometry of planetary surface grinding Machine polishing process based on[J]. Chinese Journal of Mechanical Engineering, 2002, 38(6): 144-147.

[4] Tian Yebing, Jin Zhuji, Kang Renke etc. Analysis of kinematic geometry of wafer rotation grinding[J]. China mechanical engineering, 2005, 16(20): 1798-1802.