Diffusion Bonding of Commercially Pure Titanium to Q235B Using Copper as Interlayer

Jia Geng Liu; Jing Tao Han; Jing Liu; Shuai Ji

doi:10.4028/www.scientific.net/AMR.941-944.81

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 941-944Diffusion Bonding of Commercially Pure Titanium to...

Diffusion Bonding of Commercially Pure Titanium to Q235B Using Copper as Interlayer

Abstract:

The diffusion bonding process of commercially pure titanium to Q235B is achieved using copper as interlayer. The microstructure, component distribution and phase formation at the interface is analyzed by the use of microscope, SEM and XRD, the mechanical property is also investigated through the shear test. There is a good bond at the interface from 900 to 1000°C, no big cracks and voids, Q235B/Cu interface is straight, and Cu/TA1 interface shows waviness. With the increase of diffusion temperature from 900 to 1000°C, the shear strength increases first ,and then drops, however, with the increase of holding time from 30 to 60 minutes, the shear strength drops all the time, the maximum shear strength is 80MPa at 950°C for holding time of 30 minutes.

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Periodical:

Advanced Materials Research (Volumes 941-944)

Pages:

81-88

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.941-944.81

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Online since:

June 2014

Authors:

Jia Geng Liu, Jing Tao Han*, Jing Liu, Shuai Ji

Keywords:

Copper, Diffusion Bonding, Interlayer, Mechanical Property

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