[1]
R. Hübner, M. Hecker, N. Matter, et al. Influence of nitrogen content on the crystallization behavior of thin Ta-Si-N diffusion barrier [J]. Thin Solid Films, 2004, 468(1-2): 183-192.
DOI: 10.1016/j.tsf.2004.04.026
Google Scholar
[2]
Wang Y, Cao F, Shao L, Ding M H. Diffusion barrier capability of Zr-Si films for copper metallization with different substrate bias voltage[J]. Thin Solid Films, 2009, 517(18): 5593-5596.
DOI: 10.1016/j.tsf.2009.01.001
Google Scholar
[3]
Zenglin Wang, Zonghuai Liu, Zupei Yang, Shoso Shingubara. Characterization of sputtered tungsten nitride film and its application to Cu electroless plating[J]. Microelectronic Engineering, 2008, 85(2): 395-400.
DOI: 10.1016/j.mee.2007.07.017
Google Scholar
[4]
Qi Xie, Yu-Long, Jan Musschoot, Jan Musschoot, et al. Ru thin film grown on TaN by plasma enhanced atomic layer deposition [J]. Thin Solid Films, 2009, 517 (16): 4689-4693.
DOI: 10.1016/j.tsf.2009.03.001
Google Scholar
[5]
Dung Ching Perng, Kuo Chung Hsu, Shuo-Wen Tsai, et al. Thermal and Electrical Properties of PVD Ru(P) Film as Cu Diffusion Barrier [J]. Microelectronic Engineering, 2010, 87(3): 365-369.
DOI: 10.1016/j.mee.2009.06.007
Google Scholar
[6]
Chen Jianhui, Liu Baoting, Zhao Dongyue. Investigation of Barrier Layer for Cu Interconnection on Si-based Integrate Circuit[J]. Materials Review, 2010, 24(6): 58-63.
Google Scholar
[7]
Liu Jiyan, Ma Shining, Sun Xiaofeng, Li Xin. Influence of Technique Parameters on Depositing Rate of SmCo Films Prepared by Magnetron Sputtering[J]. Journal of Materials Science & Engineering, 2011, 29(3): 411-414.
Google Scholar