The Numerical Simulation of Co-Curing Process for AGS Plate

Abstract:

Article Preview

This article demonstrates the co-curing process for AGS plate. Based on the phenomenological models of resin flow and cure kinetic, the variations of temperature, cure degree and pressure were illustrated during the process by a 2D FEA program. Some valuable results were obtained that the distribution of coupling fields could be more uniform with a proper cure cycle and mold, and the resin flow action would be completed in 6000s since the pressure was applied.

Info:

Periodical:

Advanced Materials Research (Volumes 97-101)

Edited by:

Zhengyi Jiang and Chunliang Zhang

Pages:

1764-1767

DOI:

10.4028/www.scientific.net/AMR.97-101.1764

Citation:

Q. Z. Huang et al., "The Numerical Simulation of Co-Curing Process for AGS Plate", Advanced Materials Research, Vols. 97-101, pp. 1764-1767, 2010

Online since:

March 2010

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.