Computational Analysis of Single and Multiple Impacts of Low Pressure and High Pressure Cold Sprayed Aluminum Particles Using SPH

Article Preview

Abstract:

Cold spray (CS) is a unique spraying process where the spray materials are not melted in a spray gun. Instead, the particles are kinetically deposited on the substrate at low temperature using compressed gas. This study investigates the bonding mechanism of low pressure CS (LPCS) and high pressure CS (HPCS) techniques through smoothed particle hydrodynamics (SPH) simulations, which are achieved by modeling the single and multiple particle impacts of aluminum (Al) particles on Al substrate. The impact of Al particles on the Al substrate is analyzed by evaluating the velocity, shape, temperature of the powder particles and substrate, porosity between particles, and effect of stress on the substrate. In the case of single particle impact, HPCS results in increased particle deformation. In multiple particle impact, LPCS results in low porosity. The shape of deformation, formation of pores, and residual stress of Al can be affected by the deposition process. Results indicate that LPCS is suitable for the deposition of light materials such as Al.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

147-151

Citation:

Online since:

June 2014

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2014 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

[1] T. Stoltenhoff., H. Kreye and H. J Richter: J. Therm. Spray Technol., Vol. 11 (2002), pp.542-550.

Google Scholar

[2] J. Voyer, T. Stoltenhoff, and H. Kreye: Proc. ITSC 2003 (Orlando), B.R. Marple, C. Moreau, Ed., ASM Int., pp.71-78, (2003).

Google Scholar

[3] H. Assadi, F. Gärtner, T. Stoltenhoff and H. Kreye: Acta Mater., Vol. 54 (2006), pp.729-742.

Google Scholar

[4] A. Manap and K. Ogawa: Numerical Analysis of Interfacial Bonding of Aluminum Powder Particle and Aluminum Substrate by Cold Spray Technique using the SPH Method, Proc. of the JSME/ASME 2011 Int. Conf. on Mater. And Process., Corvallis, USA, (2011).

DOI: 10.1299/jmmp.6.241

Google Scholar

[5] K. Ogawa, K. Ito, K. Ichimura, Y. Ichikawa, S. Ohno and N. Onda: J. Therm Spray Technol., Vol. 17 (2008), pp.728-735.

DOI: 10.1007/s11666-008-9254-5

Google Scholar

[6] H. Lee, H. Shin, S. Lee and K. Ko: Mater. Lett., Vol. 62 (2008), pp.1579-1581.

Google Scholar

[7] A. Manap, O. Nooririnah, H. Misran, T. Okabe and K. Ogawa: Surf. Eng. (2014).

Google Scholar

[8] A. Manap, T. Okabe and K. Ogawa: Proc. Eng., Vol. 10 (2011), p.1145 – 1150.

Google Scholar

[9] P.W. Randles and L.D. Libersky: Comput. Methods in Appl. Mech. Eng., Vol. 139 (1996), pp.375-408.

Google Scholar

[10] R.C. Batra, C.H. Kim: Int. J. Eng., Sci., Vol. 29 (1991), pp.949-960.

Google Scholar