A Sigma-Delta Modulator System Design with 2-2 Mash Structure
p.121
p.121
The Nonlinear Analysis of Readout Circuit for Microgyroscope
p.125
p.125
The Research of Noise Figure for EDFA Performance Impact
p.129
p.129
Research on Matlab Simulation Output of Optical Current Transformer
p.133
p.133
Numerical Simulation of Rapid Solidification Process for Micrometer Level Solder Ball Used in BGA Packaging
p.137
p.137
Flatness Improvement of FRA with Multi-Wavelength Pump
p.141
p.141
Semantic Feature Modeling Based on the Decomposition of Feature Dependent Graph
p.149
p.149
Word Sense Disambiguation for Improving the Quality of Machine Translation
p.153
p.153
Word Sense Disambiguation Based on Center Window
p.157
p.157
Numerical Simulation of Rapid Solidification Process for Micrometer Level Solder Ball Used in BGA Packaging
Abstract:
We numerically simulated the containerless rapid solidification for micrometer level solder ball used in BGA packaging, based on prior models for heterogeneous droplet nucleation and non-equilibrium solidification, to predict the solidification microstructure of solder ball. Results of simulations for Sn-5mass%Pb solder ball produced under different conditions are discussed.
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Periodical:
Advanced Materials Research (Volume 981)
Pages:
137-140
Citation:
Online since:
July 2014
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© 2014 Trans Tech Publications Ltd. All Rights Reserved
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