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Effects of SnCl4 Concentration on the Properties of Electroless Deposited Ni-Sn-P Coatings

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Abstract:

In this paper, the influence of SnCl4 concentration on deposition rate, tin content, corrosion resistance and surface appearance of the coating are researched respectively. The results show that SnCl4 concentration is increased, deposition rate is increased, then reduced. Tin content in the Ni–Sn–P coatings is increased with increasing SnCl4 concentration in the solutions. However, Ni and P contents in the coating is decreased slightly. The microhardness of plating before and after heat treatment is above 500HV. The hardness will be improved a little after heat treatment. With increasing SnCl4 concentration, the polarization curves slightly move to positive direction and decrease corrosion current, which shows that the introduction of tin tends to enhance resistance corrosion of the coating. When SnCl4 concentration is up to 30g/L, resistant corrosion of the films presents a drop various degrees. The deposits is smooth and uniformity, smooth by SEM and the content of tin is 2.5 to 4.1 percent by EDS.

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Periodical:

Advanced Materials Research (Volumes 989-994)

Pages:

403-406

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.989-994.403

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Online since:

July 2014

Authors:

Xi Ran Wang*, Wen Tao Wang, Bin Yang

Keywords:

Alloy Properties, Electroless Plating, Ni-Sn-P Alloy, SnCl4

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© 2014 Trans Tech Publications Ltd. All Rights Reserved

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