Study on Laser Micro Shock Effect on Electrical Resistivity of Nanometer Copper Film

Qing Xue; Yin Qun Hua; Yu Chuan Bai; Rui Fang Chen; Hai Xia Liu

doi:10.4028/www.scientific.net/AMR.989-994.45

Paper Titles

On Laser Shock Processing to Improve Hot Corrosion Resistance of In718 Superalloy
p.27

Extraction and Purification of Fluorene from Wash Oil
p.31

Microwave Hydrothermal Synthesis and Characterization of In₂O₃Nanocrystalline
p.35

Synthesis of High-Strength and Water-Resistant Phosphogypsum Small Hollow Block
p.39

Study on Laser Micro Shock Effect on Electrical Resistivity of Nanometer Copper Film
p.45

Effect of Process Parameters on Residual Stress Distribution during Direct Laser Metal Deposition Shaping
p.49

Plasma-Induced Degradation of Benzene in Aqueous Solution
p.55

Liquid Phase Rhodamine Boxidation Induced by Plasma with Glow Discharge Electrolysis
p.60

The Preparation of ZnO: Al Thin Films on Flexible Substrates by Magnetron Sputtering Method
p.65

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 989-994Study on Laser Micro Shock Effect on Electrical...

Study on Laser Micro Shock Effect on Electrical Resistivity of Nanometer Copper Film

Abstract:

The aim of this research is to improve the electrical performance of the nanometer copper film by laser micro shock processing. The nanometer copper film was prepared by the magnetron sputtering. The mechanism of laser micro shock processing effect on electrical resistivity, hardness and elastic modulus was investigated. The results show that the electrical resistivity of copper film after laser micro shock reduced by 22.5 % on average. And, the hardness and the elastic modulus increased by 38.5 % and 45.2 % on average, respectively. According to our research, we conclude that, the existence of a large number of twin, twin boundary, fault and the grow up grain are the main factor of the improvement of the electrical performance; and the existence of twin, stress concentration holes and fault are the key to improve its mechanical properties.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 989-994)

Pages:

45-48

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.989-994.45

Citation:

Cite this paper

Online since:

July 2014

Authors:

Qing Xue, Yin Qun Hua*, Yu Chuan Bai, Rui Fang Chen, Hai Xia Liu

Keywords:

Electrical Resistivity, Laser Micro Shock Processing, Nanometer Copper Film

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

* - Corresponding Author

References

[1] Liu Yunxun, et al., Surface morphology and Deformation mechanism of 304 stainless steel treated by laser shock peening, Chinese J. Laser 40 (2013) 1-8 (In Chinese).

DOI: 10.3788/cjl201340.0103004

Google Scholar

[2] Eduardo, M. Bringa, Alfredo Caro, Ultrahigh strength in nanocrystalline materials under shock loading, Science 16 September 309 (2005) 1838-1841.

DOI: 10.1126/science.1116723

Google Scholar

[3] Yinqun Hua, et al., Study of substructure in nanometer copper thin films treated by laser shock processing. Chinese Optics Letters, 11 (2013) 031402-031404.

DOI: 10.3788/col201311.031402

Google Scholar

[4] C. Rubio-González, et al., A. Banderas, J. Porro, M. Morales, Effect of an absorbent overlay on the residual stress field induced by laser shock processing on aluminum samples, Appl. Surf. Sci. 252 (2006) 6201–6205.

DOI: 10.1016/j.apsusc.2005.08.062

Google Scholar

[5] L. Lu, M.L. Sui, Lu, Superplastic Extensibility of Nanocrystalline Copper at Room Temperature, Science 287 (2002) 1463-1465.

DOI: 10.1126/science.287.5457.1463

Google Scholar

[6] K.M. Mannan, K.R. Karin, Phys F: Metal Phys, 5 (1975) 1687.

Google Scholar

[7] I. Nakamzchi, Electrical resistivity and grain boundaries in metals, Materials Science Forum 47 (1996) 207-209.

DOI: 10.4028/www.scientific.net/msf.207-209.47

Google Scholar