Electrical Simulation Experiment and the Analysis of Thermal Conductivity of Materials

Wen Bo Li; Yin Gai Jin; Shuang Yin; Pei Yan Chen

doi:10.4028/www.scientific.net/AMR.989-994.599

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 989-994Electrical Simulation Experiment and the Analysis...

Electrical Simulation Experiment and the Analysis of Thermal Conductivity of Materials

Abstract:

s: Jilin university innovation experiment Electrical Simulation Experiment and the Analysis of Thermal Conductivity of Materials aims to solve the problem of thermocouple measuring tenderness in error. Thermocouple is used to measure temperature when measuring unsteady heat conduction in laboratory. The improved measuring method of unsteady heat conduction puts the breakthrough on the electric simulation method. The text bench is constructed by different shapes of conductive plate which is made of the graphite conductive paint, and voltmeter is refitted by diodes and controlled transformer. Through the test bench, we finished the simulation of unsteady heat conduction under the similar thermal conductive boundary conditions. Finally, the error analysis of experiment and the advantages of electric simulation method are given in this paper.

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Periodical:

Advanced Materials Research (Volumes 989-994)

Pages:

599-602

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.989-994.599

Citation:

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Online since:

July 2014

Authors:

Wen Bo Li*, Yin Gai Jin, Shuang Yin, Pei Yan Chen

Keywords:

Boundary, Electrical Simulation, Innovation Experiment, Unsteady Heat Conduction

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* - Corresponding Author

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