The Higher Order Crack Tip Fields for Anti-Plane Crack in Linear Functionally Graded Piezoelectric Materials

Yao Dai; Xiao Chong; Shi Min Li

doi:10.4028/www.scientific.net/AMR.989-994.715

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 989-994The Higher Order Crack Tip Fields for Anti-Plane...

The Higher Order Crack Tip Fields for Anti-Plane Crack in Linear Functionally Graded Piezoelectric Materials

Abstract:

The crack tip field in functionally graded piezoelectric materials (FGPMs) under mechanical and electrical loadings is studied. Different from previous analyses, all material properties of the functionally graded piezoelectric materials are assumed to be linear function of y perpendicular to the crack. The crack surfaces are supposed to be insulated electrically. Similar to the Williams’ solution of homogeneous elastic materials, the higher order crack tip fields of FGPMs are obtained by the eigen-expansion method.