The Crack Tip Fields for Anti-Plane Interfacial Crack between Functionally Graded and Homogeneous Piezoelectric Materials

Abstract:

The problem of an anti-plane crack situated in the interface of functionally graded piezoelectric materials (FGPMs) and homogeneous piezoelectric materials (HPMs) is considered under the impermeable assumption of crack surfaces. The mechanical and electrical properties of the FGPMs are assumed to be exponential functions of y perpendicular to the crack. The higher order crack tip stress and electric displacement fields for FGPMs and HPMs are obtained by the eigen-expansion method. The stress intensity factor and electric displacement intensity factor are obtained explicitly.

• Periodical: Advanced Materials Research (Volumes 989-994)
• Pages: 719-722
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.989-994.719
• Online since: July 2014
• Authors: Yao Dai*, Xiao Chong
• Keywords: Crack Tip Fields, Interfacial Crack, Piezoelectric Materials, Weak-Discontinuity

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