The Effect of SiC Particle Size on the Microstructure and Hardness of SiCp/Cu Composites

Ming Hu; Li Li Tang; Lin Shan; Yun Long Zhang

doi:10.4028/www.scientific.net/AMR.997.442

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The Effect of SiC Particle Size on the Microstructure and Hardness of SiC_p/Cu Composites

Abstract:

The chemical plating technology was applied in order to improve the weaker wettability between the copper and SiC particles for electronic packaging applications. The hot-press sintering technique was executed to fabricate SiC_p/Cu composites. The influence of SiC particles size on the phase constitute, micro-structure morphology and vickers hardness were investigated in details by means of X-ray diffraction, scanning electron microscope and vickers hardness tester. The results showed that SiC particle were distributed in copper matrix uniformly and interface was clear. The relative density and vickers hardness of SiC_p/Cu composites increased as SiC particle size enhanced.

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Periodical:

Advanced Materials Research (Volume 997)

Pages:

442-445

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.997.442

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Online since:

August 2014

Authors:

Ming Hu, Li Li Tang, Lin Shan, Yun Long Zhang*

Keywords:

Chemical Plating, SiC_p/Cu Composites, Vickers Hardness

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