Nanostructured Ceramic Thin Films and Membranes by Wet Chemical Processing Methods

Abstract:

Nanostructured ceramic thin films and membranes are used for protective or functional purposes and prepared on dense or porous substrate materials. Wet chemical methods enable cheap, low-temperature, mass-scale manufacturing routes. They produce fine-grained porous and dense micro-structures that cannot be realized otherwise. In wet-chemical processing, clean nanoparticle dispersions are deposited on the substrate at, primarily, ambient conditions. The deposition is followed by a (rapid) thermal processing treatment to remove liquids and organic additives, to convert precursors to the target composition, and to establish the final porous and dense micro-structure. In the synthesis of precursor dispersions it is very important to obtain nanoparticles with a near-isometric shape and a fairly narrow particle size distribution, without the formation of secondary (agglomerate) structures. In particular the latter requires careful control of solution and interfacial chemistry to achieve proper colloidal stability, during and after the synthesis process. Characterization of coating integrity, defect morphology and defect population is done by decoration methods, microscopy, ellipsometry and statistical methods that employ membrane transport properties.

• Periodical: Advances in Science and Technology (Volume 45)
• Pages: 1252-1259
• DOI: https://doi.org/10.4028/www.scientific.net/AST.45.1252
• Online since: October 2006
• Authors: Jing Yu Shi, Matthew L. Mottern, Krenar Shqau, Henk Verweij
• Keywords: Nanoparticle Dispersion, Nanostructured Thin Films, Wet Chemical Processing

References

[1] M. Sayer and K. Sreenivas: Science Vol. 247 (1990), p.1056.

[2] H. Chen, Y. Zhang and C. Ding: Wear Vol. 253 (2002), p.885.

[3] M. Gell: Mater. Sci. Eng. A Vol. 204 (1995), p.246.

[4] K. Izumi, M. Murakami, T. Deguchi and A. Morita: J. Am. Ceram. Soc. Vol. 72 (1989), p.1465.

[5] H. Verweij: Adv. Mater. Vol. 10 (1998), p.1483.

[6] B.C.H. Steele and A. Heinzel: Nature Vol. 414 (2001), p.345.

[7] E. Ivers-Tiffee, A. Weber and D. Herbstritt: J. Eur. Ceram. Soc. Vol. 21 (2001), p.1805.

[8] A.M. Azad, S.A. Akbar, S.G. Mhaisalkar, L.D. Birkefeld and K.S. Goto: J. Electrochem. Soc. Vol. 139 (1992), p.3690.

DOI: 10.1149/1.2069145

[9] G. Sberveglieri: Sensors and Actuators B Vol. 23 (1995), p.103.

[10] C. Feldmann: Adv. Mater. Vol. 13 (2001), p.1301.

[11] J. Merikhi, H.O. Jungk, C. Feldmann: J. Mater. Chem. Vol. 10 (2000), p.1311.

[12] F.C.M. Woudenberg, W.F.C. Sager, N.G.M. Sibelt and H. Verweij: Adv. Mater. Vol. 13 (2001), p.514.

[13] J. Shi and H. Verweij: Langmuir Vol. 21 (2005), p.5570.

[14] J.C. Yu, L. Zhang, Q. Li, K.W. Kwong, A.W. Xu and J. Lin: Langmuir Vol. 19 (2003), p.7673.

[15] M. Xu, Y. Lu, U. Liu, S. Shi, T. Qian and D. Lu: Powder Techn. Vol. 161 (2006), p.185.

[16] S.C. Tjong and H. Chen: Mater. Sci. Eng. R Vol. 45 (2004), p.1.

[17] C. Burda, X. Chen, R. Narayanan and M.A. El-Sayed: Chem. Rev. Vol. 105 (2005), p.1025.

[18] M.N. Rahaman: Ceramic processing and Sintering (2 nd Edition, Dekker 2003).

[19] D.H. Napper: Polymeric Stabilization of Colloidal Dispersions (Academic Press, London 1983).

[20] J. Shi and H. Verweij: Langmuir Vol. 21 (2005), p.5570.

[21] M.L. Mottern, M. Oyola, K. Shqau, D. Yu and H. Verweij: Proceedings PCM 2005, Brugge, Belgium, October 20-21, (2005).

[22] M.L. Mottern, F. Tyholdt, A. Ulyashin, A.T.J. van Helvoort, H. Verweij and R. Bredesen: Thin Solid Films, submitted.

DOI: 10.1016/j.tsf.2006.11.015

[23] M. Bender, W. Seelig, C. Daube, H. Frankenberger, B. Ocker and J. Stollenwerk: Thin Solid Films Vol. 326 (1998), p.72.

DOI: 10.1016/s0040-6090(98)00521-5