3-D Structures via Tape Casting and Lamination

Abstract:

Miniaturisation and multi-functionality are the driving forces in the field of many technical market segments. Ceramic multilayer technology via tape casting and lamination is one of the key technologies to generate complex, highly integrated devices for future applications. The technique offers a tremendous potential for the integration of different materials combined with the possibility to form complex 3-D structures by layered object manufacturing. The ceramic multilayer technology is based on shaping, screen-printing and stacking of individual ceramic green tapes, which are laminated and co-fired. The tapes can offer ferroelectric, piezoelectric and magnetic behaviour, insulating and semi-conducting properties, voltage-, temperature- and atmosphere-dependent resistances, high thermal conductivity, corrosion resistance, or bio inert behaviour. For the integration of additional features like reactors or sensors, the described layered manufacturing method allows to introduce simultaneously microchannels and other cavities. - New developments in processing and in materials concepts are addressed to overcome limitations and to take maximum advantage of this technique. The technique is illustrated considering e.g. microwave circulators for communication, sensors for automotive applications, and piezoelectric actuators as examples, which demonstrate the potential of the technology for the manufacture of highly integrated multifunctional systems.

• Periodical: Advances in Science and Technology (Volume 45)
• Pages: 397-406
• DOI: https://doi.org/10.4028/www.scientific.net/AST.45.397
• Online since: October 2006
• Authors: Andreas Roosen
• Keywords: Co-Firing, Green Tapes, Lamination, Multilayer Technology, Tape Casting

References

[1] A. Roosen: Ceramic Trans. Vol. 97 (1999), pp.103-121.

[2] R.E. Mistler, E.R. Twiname: Tape Casting. The Am. Ceram. Soc., Westerville, Ohio, (2000).

[3] J.D. Cawley, A.H. Heuer, W.S. Newman, B.B. Mathewson: Am. Ceram. Soc. Bull., Vol. 75 (1996), p.75.

[4] H. Neumann, G. Hötzel, G. Lindemann: in Langzeitverhalten von Funktionskeramiken, P. Otschick (ed. ), Werkstoff-Informationsgesell., Frankfurt, Germany, 1997, 251-263.

[5] M. R. Gongora-Rubio, Instituto de Pesquisas Tecnológicas do Estado de São Paulo, Brasil, http: /www. njnano. org/pasi/event/talk. May (2006).

[6] D.L. Wilcox: European Microelectronic and Packaging Conf. 2001, IMAPS France, Versailles, pp.115-117, (2001).

[7] R.R. Tummala: J. Am. Ceram. Soc., Vol 74 (1991) pp.895-908.

[8] L.W. Tai, P.A. Lessing: J. Am. Ceram. Soc., Vol. 74 (1991) pp.155-160.

[9] M. Boaro, J.M. Vohs, R.J. Gorte: J. Am. Ceram. Soc., Vol. 86 (2003) pp.395-400.

[10] C.J. Russo, M.P. Harmer; H.M. Chan, G.A. Miller: J. Am. Ceram. Soc., Vol 75 (1992) pp.3396-3400.

[11] P.M. Raj, S.M. Dunn, W.R. Cannon: J. Comp. -Assist. Microsc., Vol 10 (1998) pp.33-51.

[12] M. Wagner, A. Stiegelschmitt, A. Roosen: Keramische Zeitschrift, Vol. 52 (2000), pp.490-495.

[13] H. Hellebrand: in Materials Science and Technology, Vol. 17 A, Processing of Ceramic. R.J. Brook (ed. ), VCH Verlagsgesell., Weinheim, Germany, pp.189-265, (1996).

[14] M. Piwonski, A. Roosen: J. Eur. Ceram. Soc., Vol. 19 (1996), pp.263-270.

[15] M. Wagner, A. Roosen, H. Oostra, R. Hoeppener, M. De Moya, D.H. Pearce, T. Hooley: J. Eur. Ceram. Soc., Vol. 25 (2005), pp.2463-2466.

DOI: 10.1016/j.jeurceramsoc.2005.03.211

[16] P.Z. Cai, D.J. Green, G.L. Messing: J. Am. Ceram. Soc., Vol. 80 (1997), pp.1929-39.

[17] C. -R. Chang, J. -H. Jean: J. Am. Ceram. Soc., Vol. 81 (1998), pp.2805-2814.

[18] A. Roosen, D. Pohle, M. Wagner: Ceramic Interconnect Technology Conference 2004, IMAPS USA, Denver, pp.260-265, (2004).

[19] K.G. Ewsuk: Ceramic Trans. Vol. 15 (1990), pp.279-295.

[20] J.C.M. Garnett: Phil. Trans. Roy. Soc., Vol. 203 (1904), p.385.

[21] O. Dernovsek, A. Naeini, G. Preu, W. Wersing, M. Eberstein, W.A. Schiller: J. Eur. Ceram. Soc. Vol. 21 (2001), pp.1693-1697.

DOI: 10.1016/s0955-2219(01)00096-6

[22] M. Valant, D. Suvorov: J. Eur. Ceram. Soc. Vol. 24 (2004), pp.1715-1719.

[23] J.J. Jean, C.D. Lei, J.C. Chang, S.C. In: Ceramic Interconnect Technology Conf. 2004, IMAPS USA, Denver, pp.243-247, (2004).

[24] K.R. Mikeska, R.C. Mason: Ceramic Trans., Vol. 15 (1990), pp.629-650.

[25] R. K. Bordia, R. Raj: J. Am. Ceram. Soc., Vol. 68 (1988), pp.287-292.

[26] F. Lautzenhiser, E. Amaya: Am. Ceram. Soc. Bull., Vol. 81 (2002), pp.27-32.

[27] Y.J. Seo, Y.S. Cho: In Proc. 2nd Intern. Conf. Ceramic Interconnect and Ceramic Microsystems Technologies, IMAPS, Washington, DC, April 2006, CD-ROM.

[28] M. Hagymási, A. Roosen, R. Karmazin, S. Walter, A. Naeini, R. Matz: In Proc. 1 st Intern. Conf. Ceramic Interconnect and Ceramic Microsystems Technologies. IMAPS, Washington, DC, April 2005, pp.96-102.

[29] Siemens AG, Corporate Technology, Munich, Germany, (2004).

[30] D.K. Kim, W.M. Kriven: J. Am. Ceram. Soc., Vol 86 (2003), pp.1962-64.

[31] C. Reynaud, F. Thevenot, T. Chartier, J.L. Besson: J. Eur. Ceram. Soc., Vol 25 (2005), pp.589-597.

[32] M.P. Rao, F.F. Lange: J. Am. Ceram. Soc., Vol 85 (2002), pp.1222-1228.

[33] U. Schmid: Sensors and Actuators A: Physical, Vol. 97-98 (C) (2002), pp.253-263.

[34] H. Dannheim, A. Roosen, U. Schmid: J. Amer. Ceram. Soc., Vol. 88 (2005), pp.2188-2194.