Residual Stress Measurement around the Interface of Copper Bicrystal Deformed by Uniaxial Extension

Abstract:

Residual stresses of a copper bicrystal were measured by X-ray diffraction and synchrotron radiation. A copper bicrystal specimen with a 90-degree tilt boundary was fabricated by the Brigdman technique. After the plastic extension of 30%, kink bands developed in a deformed matrix along the grain boundary. In this study, we focused on the residual stress distribution along the transverse direction of the specimen surface and the residual stresses in deformed matrix and kink band near the grain boundary. Residual stresses were evaluated by the X-ray single crystal measurement method. Stereographic projections were used to determine crystal orientations of deformed regions. It was found that crystal orientations were different between the deformed matrix and the kink band. Residual stresses in the direction along the grain boundary were compressive in the vicinity of the boundary and tensile in the region apart from the boundary. Residual stresses in the kink band were large in compression in compared with those in the deformation matrix. The difference in the results between X-rays and synchrotron radiation suggests that there is a depth variation in the deformation and therefore the residual stress development.

• Periodical: Advances in Science and Technology (Volume 64)
• Pages: 125-134
• DOI: https://doi.org/10.4028/www.scientific.net/AST.64.125
• Online since: October 2010
• Authors: Hanabusa Takao, Ayumi Shiro, Tatsuya Okada
• Keywords: Copper Bicrystal, Crystal Deformation, Interface, Micro Residual Stress, Synchrotron Radiation (XRD), X-Ray Stress Measurement

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