Ultrarapid Transient-Liquid-Phase Bonding of Advanced Ceramics

Abstract:

Article Preview

Interlayer designs and processing conditions that promote rapid and reliable transientliquid- phase (TLP) bonding/joining of Al2O3 and ZrO2-toughened Al2O3 ceramics are presented. The interplay between wetting, roughness, interlayer design and microstructure, and interlayer homogenization is described. The prospects for extending the method to other ceramics, notably the ultrahigh-temperature ceramics (UHTCs) will be discussed.

Info:

Periodical:

Edited by:

Pietro VINCENZINI, Mark HADFIELD and Alberto PASSERONE

Pages:

88-97

DOI:

10.4028/www.scientific.net/AST.64.88

Citation:

S. M. Hong et al., "Ultrarapid Transient-Liquid-Phase Bonding of Advanced Ceramics", Advances in Science and Technology, Vol. 64, pp. 88-97, 2010

Online since:

October 2010

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.