Anti-Bacteria Behaviors of TaN-Cu and TaN-Ag Nanocomposite Thin Films

Jang Hsing Hsieh; T.H. Yeh; C.S. Chiou; C.T. Huang; C. Li

doi:10.4028/www.scientific.net/AST.66.142

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HomeAdvances in Science and TechnologyAdvances in Science and Technology Vol. 66Anti-Bacteria Behaviors of TaN-Cu and TaN-Ag...

Anti-Bacteria Behaviors of TaN-Cu and TaN-Ag Nanocomposite Thin Films

Abstract:

TaN–Cu and TaN-Ag nanocomposite films were deposited by reactive co-sputtering on Si. The films were then annealed using RTA (Rapid Thermal Annealing) at 400 °C for 2, 4, 8, 15 minutes respectively to induce the nucleation and growth of metal particles in TaN matrix and on film surface. The samples were then tested for their anti-bacterial behaviors against Gram-negative and Gram-positive bacteria. The results were compared with the solubility of Ag and Cu in a buffer solution. Under similar ion concentrations, it is concluded that Ag ion or TaN-Ag is more effective against E. Coli (Gram-negative), while Cu ion or TaN-Cu is more effective against Staphylococcus aureus (Gram-positive).

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Advances in Science and Technology (Volume 66)

Pages:

142-149

DOI:

https://doi.org/10.4028/www.scientific.net/AST.66.142

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Online since:

October 2010

Authors:

Jang Hsing Hsieh, T.H. Yeh, C.S. Chiou, C.T. Huang, C. Li

Keywords:

Anti-Bacteria, Co-Sputtering, Nanocomposite Thin Film, TaN–Ag, TaN-Cu

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References

[1] K. Shimamura, Y. Matsumoto, and T. Matsunaga, Surf. Coat. Technol. 50 (1992) 127.

Google Scholar

[2] J. Kim, M. Cho, B. Oh, S. Choi, J. Yoon, Chemosphere 55 (2004) 775.

Google Scholar

[3] D. P. Dowling, A. J. Betts, C. Pope, M. L. McConnell, R. Eloy and M. N. Arnaud, Surf. Coat. Technol. 163-164 (2003) 637.

Google Scholar

[4] T. Yuranova, A. G. Rincon, A. Bozzi, and S. Parra, Journal of Photochemistry and Photobiology A 161 (2003) 27.

Google Scholar

[5] J. H. Hsieh, C. M. Wang, and C. Li, Surf. Coat. Technol. 200 (2006) 3179.

Google Scholar

[6] T. Lauria, K. Zeng, J. K. Kivilahti, J. Molarius, T. Riekkinen, and I. Suni, Microelectronic Engineering 60 (2002) 71.

DOI: 10.1016/s0167-9317(01)00582-2

Google Scholar

[7] J. H. Hsieh, P. C. Liu, M. K. Cheng, and P. W. Kuo, Journal of Scanning Probe Microscopy 2 (2007) 1-4.

Google Scholar

[8] B. D. Ratner, A. S. Hoffman, F. J. Schoen, and J. E. Lemons, Biomaterials Science, 2nd Ed., Elsevier Academic Press, (2004).

Google Scholar

[9] S. Cai, X. Xia, C. Xie, Corrosion Science 47 (2005) 1039.

Google Scholar

[10] J. H. Hsieh, P.C. Liu, C. Li, M.K. Cheng, S.Y. Chang, Surf. Coat. Technol. 202 (2008) 5530.

Google Scholar

[11] J. H. Hsieh, M. K. Cheng, Y. K. Chang, C. Li, C. L. Chang, and P. C. Liu, J. Vac. Sci. Technol. A, 26 (2008) 1093.

Google Scholar