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Abstracts
Cu: Dislocations and Stacking Faults
a.222
Cu: Point Defects
a.223
Cu, Ni, NiAl, Ni3Al: Point Defects
a.224
Cu: Twins
a.225
Cu-(0.05 to 5at%)Al: Dislocations and Grain Boundaries
a.226
Cu-Al-Ni: Twins
a.227
Cu3Au, Ni3Al, NiAl: Point Defects
a.228
Fe: Electromigration
a.229
Fe-Al: Dislocations
a.230

Cu-(0.05 to 5at%)Al: Dislocations and Grain Boundaries

Page: A226

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