Abstracts

Cu, Cu-0.091at%Ag: Ag Grain Boundary Diffusion
a.221

Cu: Dislocations and Stacking Faults
a.222

Cu: Point Defects
a.223

Cu, Ni, NiAl, Ni₃Al: Point Defects
a.224

Cu: Twins
a.225

Cu-(0.05 to 5at%)Al: Dislocations and Grain Boundaries
a.226

Cu-Al-Ni: Twins
a.227

Cu₃Au, Ni₃Al, NiAl: Point Defects
a.228

Fe: Electromigration
a.229

HomeDefect and Diffusion ForumDefect and Diffusion Forum Vols. 131-132Cu: Twins

Cu: Twins

Page: A225