Paper Titles

Grain Boundary Diffusion in Solids: Recent Advances and Applications
p.1343

Atomistic Theory and Computer Simulation of Grain Boundary Diffusion
p.1357

Diffusion-Induced Instabilities at Internal Interfaces in Solids
p.1373

Antimony Diffusion along Symmetric <001> Tilt Grain Boundaries in Copper
p.1385

Grain Boundary Self- and Solute Diffusion and Segregation in General Large Angle Grain Boundaries in Copper
p.1391

Grain Boundary Diffusion and Electromigration in Cu-Sn Alloy Thin Films and their VLSI Interconnects
p.1397

Effect of Temperature and Pressure on Grain Boundary Segregation and Wetting
p.1407

Local Structures and Physical Properties of Atomic Probes Localization Regions in the Intercrystalline Diffusion Zone of⁵⁷Co in Polycrystalline Tungsten
p.1413

Investigation of Intercrystalline Diffusion of⁵⁷Co in Poycrystalline Tungsten: The Influence of the Atomic Probe Segregation and Segregation of Residual Interstitial Impurities on Regularities of the Intercrystalline Diffusion
p.1421

HomeDefect and Diffusion ForumDefect and Diffusion Forum Vols. 143-147Grain Boundary Self- and Solute Diffusion and...

Grain Boundary Self- and Solute Diffusion and Segregation in General Large Angle Grain Boundaries in Copper

Article Preview

Abstract:

You might also be interested in these eBooks

Diffusion in Materials DIMAT 1996

Info:

Periodical:

Defect and Diffusion Forum (Volumes 143-147)

Pages:

1391-1396

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.143-147.1391

Citation:

Cite this paper

Online since:

January 1997

Authors:

T. Surholt, Christian Herzig

Keywords:

Copper (Cu), Grain Boundary, Grain Boundary Self- and Solute Diffusion, Segregation

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 1997 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation: