Grain Boundary Self- and Solute Diffusion and Segregation in General Large Angle Grain Boundaries in Copper
p.1391
p.1391
Grain Boundary Diffusion and Electromigration in Cu-Sn Alloy Thin Films and their VLSI Interconnects
p.1397
p.1397
Effect of Temperature and Pressure on Grain Boundary Segregation and Wetting
p.1407
p.1407
Local Structures and Physical Properties of Atomic Probes Localization Regions in the Intercrystalline Diffusion Zone of57Co in Polycrystalline Tungsten
p.1413
p.1413
Investigation of Intercrystalline Diffusion of57Co in Poycrystalline Tungsten: The Influence of the Atomic Probe Segregation and Segregation of Residual Interstitial Impurities on Regularities of the Intercrystalline Diffusion
p.1421
p.1421
Grain Boundary Diffusion Coefficients of59Fe in Alloy 800 and Influence of Interface-Active Elements on Grain Boundary Diffusion
p.1429
p.1429
Tracer Grain Boundary Diffusion of Nickel in Pure and Boron-Doped Ni3AI
p.1435
p.1435
Temperature and Concentration Dependence of Grain Boundary Diffusion of 63Ni in Pure and Boron-Doped Ni3Al
p.1441
p.1441
Diffusion and Structure of Defects in Ni-Base Superalloy Single Crystals
p.1447
p.1447
Investigation of Intercrystalline Diffusion of57Co in Poycrystalline Tungsten: The Influence of the Atomic Probe Segregation and Segregation of Residual Interstitial Impurities on Regularities of the Intercrystalline Diffusion
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Periodical:
Defect and Diffusion Forum (Volumes 143-147)
Pages:
1421-1428
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Online since:
January 1997
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© 1997 Trans Tech Publications Ltd. All Rights Reserved
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