Grain Boundary Diffusion and Electromigration in Cu-Sn Alloy Thin Films and their VLSI Interconnects

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Periodical:

Defect and Diffusion Forum (Volumes 143-147)

Edited by:

H. Mehrer, Chr. Herzig, N.A. Stolwijk, H. Bracht

Pages:

1397-1406

DOI:

10.4028/www.scientific.net/DDF.143-147.1397

Citation:

D. Gupta et al., "Grain Boundary Diffusion and Electromigration in Cu-Sn Alloy Thin Films and their VLSI Interconnects", Defect and Diffusion Forum, Vols. 143-147, pp. 1397-1406, 1997

Online since:

January 1997

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$35.00

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