Paper Titles

Grain Boundary Diffusion and Electromigration in Cu-Sn Alloy Thin Films and their VLSI Interconnects
p.1397

Effect of Temperature and Pressure on Grain Boundary Segregation and Wetting
p.1407

Local Structures and Physical Properties of Atomic Probes Localization Regions in the Intercrystalline Diffusion Zone of⁵⁷Co in Polycrystalline Tungsten
p.1413

Investigation of Intercrystalline Diffusion of⁵⁷Co in Poycrystalline Tungsten: The Influence of the Atomic Probe Segregation and Segregation of Residual Interstitial Impurities on Regularities of the Intercrystalline Diffusion
p.1421

Grain Boundary Diffusion Coefficients of⁵⁹Fe in Alloy 800 and Influence of Interface-Active Elements on Grain Boundary Diffusion
p.1429

Tracer Grain Boundary Diffusion of Nickel in Pure and Boron-Doped Ni₃AI
p.1435

Temperature and Concentration Dependence of Grain Boundary Diffusion of ⁶³Ni in Pure and Boron-Doped Ni₃Al
p.1441

Diffusion and Structure of Defects in Ni-Base Superalloy Single Crystals
p.1447

Nickel Self-Diffusion along Grain Boundaries in Ni₃Al-Base Intermetallic Alloys
p.1453

HomeDefect and Diffusion ForumDefect and Diffusion Forum Vols. 143-147Grain Boundary Diffusion Coefficients of59Fe in...

Grain Boundary Diffusion Coefficients of⁵⁹Fe in Alloy 800 and Influence of Interface-Active Elements on Grain Boundary Diffusion

Article Preview

Abstract:

You might also be interested in these eBooks

Diffusion in Materials DIMAT 1996

Info:

Periodical:

Defect and Diffusion Forum (Volumes 143-147)

Pages:

1429-1434

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.143-147.1429

Citation:

Cite this paper

Online since:

January 1997

Authors:

J. Lindemann, K. Hennesen, Hans Jürgen Grabke

Keywords:

Activation Energy, Alloy 800, Arrhenius Equation, Autoradiographs, Bulk Diffusion, Diffusion Coefficient, Grain Boundary Diffusion of⁵⁹Fe, Grain Boundary Self-Diffusion, Influence of Phosphorus, Interface-Active Elements, Radioactive Tracer Method, Suzuoka's Approximation

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 1997 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation: