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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vols. 194-199Reactive Interdiffusion of Cu/Co/Au Thin-Film...

Reactive Interdiffusion of Cu/Co/Au Thin-Film Couples Investigated by 3-Dimensional Atom-Probe

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Diffusion in Materials DIMAT2000

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Periodical:

Defect and Diffusion Forum (Volumes 194-199)

Pages:

1525-1532

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.194-199.1525

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Online since:

April 2001

Authors:

Ch. Lang, G. Schmitz, Reiner Kirchheim

Keywords:

Diffusion Barrier, TAP, Thin Film Reaction, Tomographic Atom-Probe

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© 2001 Trans Tech Publications Ltd. All Rights Reserved

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